International Test Solutions Announces Japan Branch Office and Appointment of Masahiro Sato as General Manager

Reno, Nevada based, semiconductor test company, International Test Solutions (ITS) announced official plans to expand its worldwide customer service and sales support network with a branch office in Tokyo, Japan and has appointed Masahiro Sato as General Manager.

Reno, Nevada (PRWEB) September 4, 2008 -- International Test Solutions (www.inttest.net), the leading provider of engineered polymer cleaning materials and technical services for wafer probe card technologies, has announced the opening of a branch office in Tokyo, Japan. The new branch office will provide Japanese customers an easily accessible, direct link to ITS's applications engineering and sales support teams.

"The Tokyo branch office extends the reach of our resources, enabling better customer service and resolution of the complex on-line cleaning related issues for our existing Japanese customers." said Gene Humphrey, President and founder of International Test Solutions. Mr. Humphrey added, "The new office will also guarantee the highest level of comprehensive support for future customers in Japan."

Masahiro Sato has been appointed as the General Manager for International Test Solutions - Japan branch. Mr. Sato joins ITS from King Yuan Electronics, Co. (KYEC), where he worked for several years as the Japan marketing director. Prior to joining KYEC, Mr. Sato held key positions as an engineer at IBM Japan and served a business development consultant for overseas companies penetrating into the Japanese technical markets.

"Masahiro Sato's 25+ years of experience in the semiconductor industry and his outstanding skills in implementing business development strategies will be a strong assets to ITS as we continue to expand our business in Japan.", commented Gene Humphrey.

About International Test Solutions, Inc. (ITS)

International Test Solutions provides non-destructive probe card cleaning products used by semiconductor manufacturers to remove debris and contaminants generated during wafer level and burn-in/test socket testing. By removing loose debris and adherent contaminants in-line, the quality of the testing data is improved, the test equipment downtime is reduced, throughput is increased and manufacturing yields are improved.

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