Free Semiconductor Manufacturing Process Seminar Webcast, Presented by Speedline Technologies:

Lead-Free Reflow Soldering" Thursday, August 19, 2004 11 AM -- NOON, ET & 2 PM -- 3 PM, ET

(PRWEB) August 2, 2004 -- As the industry continues the transition to lead-free manufacturing, there are still many questions to consider before implementation on your manufacturing floor. What equipment and process changes are required? What details must the process engineer consider to optimize the lead-free process?

This seminar, presented by Speedline Technologies (www.speedlinetech.com), will provide an overview of lead-free reflow soldering. Topics will include:

· Reflow equipment configurations and differences

· Producing lead-free assemblies

· Nitrogen process variables

· Cooling considerations

· Cost of operation

The seminar is free. To register, or for more information, visit www.speedlinetech.com/seminars on the Web or call 508-541-4749.

Participation is as easy as visiting a website and dialing into a toll-free telephone number.

Future seminar topics and dates include:

· Thursday, Sept. 23: Lead-Free Wave Soldering

· Thursday, Oct. 21: Improving Final Product Quality

· Thursday, Nov. 18: Reliable Underfill Dispensing

· Thursday, Dec. 16: The Fine Pitch Printing Process

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