Speedline Technologies Schedules Free Monthly Technical Webcast Seminars - Upcoming Sessions to Explore Final Product Quality, Reliable Underfill Dispensing, Fine Pitch Printing

Speedline Technologies, Inc. (http://www.speedlinetech.com) has scheduled a series of free monthly technical webcast seminars exploring the major challenges facing engineers in the semiconductor manufacturing process. Each of the seminars, to be hosted by industry experts, will include the sharing of "knowledge in process" expertise, how-to insights, and a Q&A session.

FRANKLIN, MASSACHUSETTS (PRWEB) October 12, 2004

Speedline Technologies, Inc. has scheduled a series of free monthly technical webcast seminars exploring the major challenges facing engineers in the semiconductor manufacturing process. Each of the seminars, to be hosted by industry experts, will include the sharing of "knowledge in process" expertise, how-to insights, and a Q&A session. The schedule is:

"IMPROVING FINAL PRODUCT QUALITY"

• Thursday, October 21, 2004
• Live: 11 AM - NOON, ET, and
• Live: 2 PM - 3 PM, ET
• The cost of a defect increases exponentially as it moves through the production process. A defect that ships to a customer costs hundreds of times more than an error that is discovered immediately after the printing process. However, even in a well-controlled production environment, defects still occur. What can be done to limit the number of defects and their impact on your production capabilities? This seminar will cover the following topics:

         - Impact of printing defects on first pass yield

         - Preventing defects

         - Inspection and test process planning

         - 2D and 3D solder paste inspection

"RELIABLE UNDERFILL DISPENSING"

• Thursday, November 18, 2004
• Live: 11 AM - NOON, ET, and
• Live: 2 PM - 3 PM, ET
• There are many applications for underfill dispensing and all require significant knowledge about the various materials and equipment used for the process. This chip connection process step is critical for flip chip manufacturing and can use many types of materials. This seminar will cover the following topics:

         - Underfill materials

         - Underfill process variables

         - Improving material flow

         - Equipment variables

         - Equipment optimization & dispensing patterns

"FINE PITCH PRINTING PROCESS"

• Thursday, December 16, 2004
• Live: 11 AM - NOON, ET, and
• Live: 2 PM - 3 PM, ET
• As technology continues to move towards smaller components, it becomes increasingly important to print to meet fine pitch requirements. With 0201 chips, chip scale packages and microBGAs becoming more prevalent, a process engineer must fully understand every aspect of the fine pitch printing process. Topics in this seminar will include:

         - Solder paste evaluation

         - Lead free solder paste printing

         - Stencil design, including pin-in-paste

         - Aperture design

         - 45 degree printing

         - Board support

         - Fast cycle time printing

         - Post-print inspection (2D and 3D)

All seminars are free. Participation is as easy as visiting a website and dialing into a toll-free telephone number.

To register or for more information, visit http://www.speedlinetech.com/seminars on the Web, or call 508-541-4749.

About Speedline Technologies

Speedline Technologies is the global leader for single-source process knowledge, solutions, and service to the PCB assembly and semiconductor packaging industries. Based in Franklin, Massachusetts, USA, the company sells five, best-in-class brands - Accel(r) microelectronics cleaning, Camalot(r) dispensing systems, Electrovert(r) wave soldering, reflow soldering, and cleaning equipment, MPM(r) stencil and screen printing systems, and Protect(r) global services, support, and training solutions. For more information, visit us at http://www.speedlinetech.com.

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