German System Manufacturer Announces Plans for a Technical Application Center in Yokohama, Japan

Heidelberg Instruments, a leader in design, development and production of laser lithography systems, has announced plans of opening a Technical Application Center in Yokohama, Japan. The new center will house state of the art Heidelberg Instruments R&D equipments and process systems, will expand local technical sales activities and provide application support in Japan and Asia Pacific region. The center will be located in the same vicinity as the Heidelberg Instruments Service Japan. Operations will start in July 2009.

Heidelberg, Germany (PRWEB) March 22, 2009 -- Heidelberg Instruments, a leader in design, development and production of laser lithography systems, has announced plans of opening a Technical Application Center in Yokohama, Japan. The new center will house state of the art Heidelberg Instruments R&D equipments and process systems, will expand local technical sales activities and provide application support in Japan and Asia Pacific region. The center will be located in the same vicinity as the Heidelberg Instruments Service Japan. Operations will start in July 2009.

"The new clean room will be our first fully dedicated technical application center in the Asia Pacific region and will be managed by some of our most experienced technical staff", states Alexander Forozan, Vice President of Global Sales and Business Development "it will boost our plans for continued presence and success in the region, enable us to closely interact with the leading lithography and micro technology manufacturers and researchers and provide an effective tool for future business and technology development".

About Heidelberg Instruments, GmbH: With an installation base in over 30 countries, Heidelberg Instruments is a world leader in production of high precision maskless lithography systems. These systems are used for direct writing and photomask production by some of the most prestigious universities and industry leaders in the areas of Advanced Electronic Packaging, MEMS, BioMEMS, Nano Technology, ASICS, Display, Micro Optics, and many other related applications.

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