Speedline Technologies Announces Free Jan. 19, 2006 Webinar Focusing on Lead Free SMT Printing Process

Speedline Technologies experts will tackle one of the SMT industry’s most critical manufacturing challenges – the Lead Free Printing Process -- in a free, live webinar on Thursday, January 19, 2006, at http://www.speedlinetech.com/seminars.

Franklin, MA (PRWEB) January 3, 2006 -- Speedline Technologies experts will tackle one of the SMT industry’s most critical manufacturing challenges -- the Lead Free Printing Process -- in a free, live webinar on Thursday, January 19, 2006.

Designed for OEM and CEM process engineers, the one-hour Internet-based seminar will draw from expertise that Speedline Technologies’ engineers have acquired through its testing and printing of lead free solder pastes over nearly seven years. Their experience includes conducting formal designed experiments (DOE) and statistical studies on lead free solder paste printing, working with virtually all of the major solder paste suppliers, and close consultations with their own OEM and CEM customers. Throughout their efforts, the engineers have been evaluating the process performance characteristics of their tin lead and lead free solder pastes.

The Web cast will begin at 11:00 a.m. ET. Specific areas of discussion will include:

• Solder Paste Volume

• Solder Paste Release form the Stencil

• Stencil Design

• Stencil Fabrication

• Enclosed Print Heads

• Printing Accuracy

• A Questions & Answers opportunity

For more information, or to register, go to http://www.speedlinetech.com/seminars or call 1-508-541-4749.

The event is the first in a new monthly series of free webinars hosted by Speedline Technologies. They are scheduled throughout 2006 as follows:

• Thursday, February 16, 11:00 a.m. ET: 0201 and 01005 Component Assembly Process

• Thursday, March 16, 11:00 a.m. ET: Lead Free Reflow Soldering

• Thursday, April 13, 11:00 a.m. ET: Adhesive Printing

• Thursday, May 18, 11:00 a.m. ET: Pin in Paste (Intrusive Reflow)

• Thursday, June 15, 11:00 a.m. ET: Lead Free Wave Soldering

• Thursday, July 13, 11:00 a.m. ET: Challenges of High Speed Underfill

• Thursday, August 17, 11:00 a.m. ET: Lead Free Printing Process

• Thursday, September 14, 11:00 a.m. ET: Practical DOE and SPC for Electronics Assembly

• Thursday, October 19, 11:00 a.m. ET: Cleaning Lead Free Residues

• Thursday, November 16, 11:00 a.m. ET: MicroDot Dispensing

• Thursday, December 14, 11:00 a.m. ET: 0201 and 01005 Component Assembly Process

To register on the Web, visit: http://www.speedlinetech.com/seminars or call 1-508-541-4749.

About Speedline Technologies

Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands — Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. Speedline Technologies is Frost & Sullivan’s “2005 Surface Mount Technology Company of the Year.” For more information, visit: http://www.speedlinetech.com or contact Speedline at:

• USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288;

• Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299;

• Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411.

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