Amkor Technology, Inc. speaks on 3D and Thin Packaging Technologies at EtroniX 2001

Amkor Technology, Inc. will present a three-hour workshop, entitled Trends, Applications and Advances in 3D and Thin Packaging Technologies" in the Microelectronics Packaging International Conference at EtroniX 2001. The workshop will take place on Monday, February 26, 2001 at 1:00pm.

The course will introduce the audience to emerging applications and advances in 3D and thin packaging technologies that may apply to their advanced packaging requirements. Also, the course will outline the associated performance, initial applications and reliability for these new 3D and thin packages which are part of the application specific packaging wave driven by system package integration requirements.

Semiconductor packaging is an integral part of the supply chain cycle. MP International is a great forum for Amkor to showcase its latest technology, packaging and services" – Amkor Technology

For more information or to register by phone, call contact customer service at 1-800-467-5656 or 1-203-840-5656. Or visit the EtroniX web site at www.etronixexpo.com.