Thermal Management in Microelectronics Course Presented at EtroniX 2001

Norwalk, CT – January 9, 2001 - Al Krum, Applications Engineer at Raytheon Electronic Systems will present a course on Thermal Management in the Microelectronics Packaging International Conference at EtroniX 2001. The course will take place on Monday, February 26, 2001 from 1:00pm to 4:00pm.

This course will provide an introduction into the thermal management of microelectronic devices, looking at the materials comprising the various packaging approaches (MCMs, hybrids and single chip packages), identifying the heat sources, defining the heat paths and providing various analysis techniques. Methods of measuring thermal resistances and thermal conductivity will be presented. In addition to theory, cost tradeoffs will be presented for use in commercial, industrial, military and space applications.

EtroniX 2001 is produced and managed by the Electronics Group of Reed Exhibition Companies (REC). EtroniX will be held February 25 – March 1, 2001 at the Anaheim Convention Center in Anaheim, California.

For more information or to register by phone, contact customer service at 1-800-467-5656 or 1-203-840-5656. Or visit the EtroniX web site at www.etronixexpo.com.