NEW LGA/BGA SOCKET FROM ARIES DESIGNED FOR HIGH PERFORMANCE ASIC APPLICATIONS

NEW LGA/BGA SOCKET FROM ARIES DESIGNED FOR HIGH PERFORMANCE ASIC APPLICATIONS

Frenchtown, NJ, February 2002 -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a land grid array/ball grid array (LGA/BGA) socket for high performance ASIC applications.

The new socket features pressure mount contacts on the top and bottom to prevent overstress on the socket. Offset radial contact with the devices solder balls will not alter the solder ball bottom surface. Optional bias springs can be built into the socket to provide accurate device registration.

Made from beryllium copper alloy with 30µ" gold per MIL-G-45204 over 50µ" nickel per QQ-N-290, the socket also incorporates high temperature liquid crystal polymer (LCP).

-more-
AR-7036

As with all Aries sockets, the LGA/BGA socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.

Pricing for the LGA/BGA sockets start at $10.00 in quantities of 500. Delivery is
6 weeks ARO.