NanoVia, LP Strengthens Its Microvia Patent Portfolio

NanoVia, LP, an innovative leader in the development of next generation high speed microvia drilling technology, today announced the receipt of Notice of Allowance for a U.S. patent, entitled Control System and Apparatus for Ablating High-Density Array of Vias or Indentation in Surface of Object. The invention patented, combines the optics and precision of laser imaging with a wide range of hybrid holographic and diffractive optical elements, allowing a manufacturer to access new levels of throughput and substantial reductions of process costs, otherwise unattainable using todays technology.

PRESS RELEASE
For Immediate Release
June 10, 2002
NanoVia, LP Strengthens Its Microvia Patent Portfolio
Londonderry, NH, June 10, 2002 - NanoVia, LP, an innovative leader in the development of next generation high speed microvia drilling technology, today announced the receipt of Notice of Allowance for a U.S. patent, entitled Control System and Apparatus for Ablating High-Density Array of Vias or Indentation in Surface of Object. The invention patented, combines the optics and precision of laser imaging with a wide range of hybrid holographic and diffractive optical elements, allowing a manufacturer to access new levels of throughput and substantial reductions of process costs, otherwise unattainable using todays technology. The optical module and control system is flexible to facilitate quick and simple or complex grid array package configurations, and small enough to integrate into most existing laser microvia systems. In addition, the optical and control system provides unprecedented drilling speeds, which is critical for future high-density grid array packages use for processor and memory chips.
NanoVia, LP has previously received and/or filed nearly 20 patents and has patents pending in the fields of Microvia Drilling, Servo Control, Micro Optics, Beam Delivery, Holographic Optics" that have been applied to most microelectronic packaging and telecom applications.
Our strong patent portfolio, proprietary designs, and micro optics manufacturing technologies allow us to develop and combine compactness, flexibility, state-of-the-art laser image quality, and close loop control capability into competitively-priced optical modules and accessories. We are licensing this technology to companies outside the microelectronics packaging field, while maintaining focus on our primary objective - to build our high speed microvia drilling product line, " says Todd E. Lizotte, Vice President of R&D and CDO of NanoVia, LP.
Timing is critical in todays chip packaging markets, and we are confident that we are in the right place at the right time," continued Lizotte.
With its continuing advancement of high-speed microvia drilling technology, NanoVia, LP is contributing to and enhancing the way chip package manufacturers produce the next generation of high-density products.
NanoVia, LP -- General
NanoVia, LP develops, designs and builds automated manufacturing equipment, optical systems and assembly/fabrication processes for the microelectronics packaging, telecom and micro-systems market. NanoVias core objective is to create intellectual property for licensing and sale to these markets. NanoVia welcomes inquiries about its technologies and system solutions.

Information Contacts:

NanoVia, LP
4 Delta Drive, Suite 6
Londonderry, NH 03053         
Mr. Todd E. Lizotte, Vice President of R&D          
Phone:    603-421-0713            
Fax:    603-421-0214                  
Email: telizotte@nanovia.com