NanoVia Develops Hyper-Speed Microvia Drilling Process For Next Generation 3G High Density Smart Chip Package

NanoVia, LP announces the development of its latest technology, the HyperViaTM holographic microvia drilling technology for drilling current and next generation high-density 3G smart chip carrier packages. The HyperViaTM microvia drilling technology can produce microvias on randomly pitched grid arrays at process rates exceeding 100% faster than current laser systems on the market; this throughput rate is anticipated to triple within the next 10 months, once a new laser technology arrives from one of its strategic laser vendors.

NanoVia Develops Hyper Speed Microvia Drilling Process For Next Generation 3G High Density Smart Chip Packaging

For Immediate Release
June 26, 2002

Londonderry, NH (June 26, 2002) -- NanoVia, LP announces the development of its latest technology, the HyperViaTM holographic microvia drilling technology for drilling current and next generation high-density 3G smart chip carrier packages. The HyperViaTM microvia drilling technology can produce microvias on randomly pitched grid arrays at process rates exceeding 100% faster than current laser systems on the market; this throughput rate is anticipated to triple within the next 10 months, once a new laser technology arrives from one of its strategic laser vendors.
The new HyperViaTM technology is the second iteration of an optical system licensed to Hitachi Via Mechanics, Japan in a four-year exclusive license. NanoVia has already delivered several optical sub-systems to Hitachi and will begin to ship modules as the technology enters the US and Asian markets.
The growth forecast of the 3G (Third Generation) communications marketplace is substantial and will require chip scale packages with microvia densities unparallel to existing designs. Our goal is to regain lost ground on the US high density technology roadmap and to deliver solid process hardware to meet the continuing demands of leading US IC Chip manufacturers," explains Todd Lizotte, VP of R&D at NanoVia, LP.
NanoVia, LP -- General
NanoVia, LP develops, designs and builds automated manufacturing equipment, optical systems and assembly/fabrication processes for the microelectronics packaging, telecom and micro-systems market. NanoVias core objective is to create intellectual property for licensing and sale to these markets. NanoVia welcomes inquiries about its technologies and system solutions.

Information Contacts:

NanoVia, LP            
Mr. Todd Lizotte, Vice President of R&D         
Phone: 603-421-0713            
Fax:    603-421-0214                  
Email: telizotte@nanovia.com