NanoVia Announces MultiDiceTM Laser Based Semiconductor Wafer Dicing Technology

NanoVia, LP announces the development of an optical beam delivery system specifically tailored to improving the throughput of laser-based semiconductor wafer dicing processes. Using a patent pending dual and triple wavelength technology, the MultiDiceTM platform provides pre-removal of first layer materials, including low-k dielectric and other coatings that are either brittle or at risk of damage due to specific laser wavelengths.

NanoVias latest optical system MultiDiceTM will utilize a laser with multiple UV and IR wavelengths. Present tests show potential increased throughput of 60% over current dicing methods, with a projected target of nearly 100% with newer high power lasers being developed by its laser vendor.

Anticipating the need for extreme high-speed processes to support the HDI roadmap in the United States and in Asia, NanoVia has made its top priority the development of new technologies to meet the demands of the HDI marketplace; most specifically in IC packaging processes.

The MultiDiceTM technology is a hybrid design utilizing portions of existing elements from NanoVias current line of patented and patent-pending optical systems for micro via drilling, IC memory repair and SMD trimming, including NanoVias latest HyperViaTM technology.

NanoVia is targeting growth markets and bringing technology that can meet the demand for increase throughput," explains Todd Lizotte, VP of R&D at NanoVia, LP. The 300 mm wafer market needs updated processes from wafer dicing to the packaging of the ICs." He concludes, Our goal is to work with partners to bring this technology to market in a timely manner."

NanoVia, LP develops, designs and builds automated manufacturing equipment, optical systems and assembly/fabrication processes for the microelectronics packaging, telecom and micro-systems market. NanoVias core objective is to create intellectual property for licensing and sale to these markets. NanoVia welcomes inquiries about its technologies and system solutions.

Information Contacts:
NanoVia, LP            
Mr. Todd Lizotte, Vice President of R&D         
Phone:   603-421-0713            
Fax:    603-421-0214                  
Email:    telizotte@nanovia.com