NanoVia Targets Wafer Scale Technology

October 8, 2002 (Londonderry, NH)-- NanoVia, LP announces the introduction of UltraViaTM, an optical system configuration adapted to efficiently drill high aspect ratio vias and microvias into silicon substrates for wafer scale packaging applications. The UltraViaTM optical platform will be the first product targeted towards true wafer level packaging. The hybrid optical subsystems are integrated into a monolithic platform providing several key advantages for drilling microvias through bulk silicon wafers or through thin spun on dielectric thin films.

The optical system is capable of processing material within a vacuum or purged environment to minimize recasting of debris formed when drilling occurs, and is offered with integrated micro viewing of various transparent films using a NanoVia designed contrasted interference based microscope imaging system. NanoVia is pursuing partnership and Joint Venture opportunities with semiconductor tool builders in the United States, Taiwan and Japan.

NanoVia has always positioned itself in growth market areas, and the growing needs of the wafer scale packaging market were anticipated at the beginning of product development in 1999. NanoVia expects market expansion in wafer level flip chip designs by domestic producers of high value added custom ASIC, memory, processor and system on a chip products, for such applications as optical detection, inertial navigation and optical communications for military products, all of which will ultimately drive the commercial consumer marketplace.

Leveraging our optical solutions know-how with existing manufacturers of semiconductor processing equipment is the best way to bridge the gap caused by the current lag in efficiency that most chip producers face as the high density marketplace moves forward," explains Todd Lizotte, Vice President of R&D at NanoVia, LP.

NanoVia, LP develops, designs and builds automated manufacturing equipment, optical systems and assembly/fabrication processes for the microelectronics packaging, telecom and micro-systems market. NanoVias core objective is to create intellectual property for licensing and sale to these markets. NanoVia welcomes inquiries about its technologies and system solutions.

For all of NanoVias most recent news, visit www.3GOPtics.com.

Contact:
Todd Lizotte, Vice President of R&D
NanoVia, LP
4 Delta Drive, Suite 6
Londonderry, NH 03053
P: 603-421-0713
F: 603-421-0214
mailto:telizotte@nanovia.com