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NEW CAM LID FOR ARIES HIGH FREQUENCY TEST SOCKETS
HELPS ELIMINATE DAMAGE TO PACKAGE PADS
Frenchtown, NJ, October 2002 -- Aries Electronics, Inc., an international manufacturer of standard, programmed and custom interconnection products, now offers its line of high frequency test sockets with a new CAM lid that helps eliminate damage to package pads. By providing precise Z-directional force with no X or Y movement, no stress is applied against the side of the contacts and solder balls remain undamaged. Additionally, the load can be applied to the device after the socket is closed and latched.
The new lid can be used on both double-latched and hinged designs in any of Aries high frequency test sockets, including Microstrip Contact, Spring Probe, and Kapton Interposer sockets.
The CAM lid provides no preload on package when the lid is in the open position, making it easier to apply the load, especially in high I/O counts. The lid's positive spring clip lock in the closed position ensures that there is no loss of Z-force during test, resulting in increased accuracy. Only a ¼ turn is needed for a full .045" of Z-directional travel providing quick actuation.
The lids aluminum base supports CAM and pressure assembly to help maintain full compression on the package during test so there is no loss of Z movement due to deflection. All insulating material is made from Torlon 5530, a 30% glass filled Polyamide-imide (PAI) that provides greater dimensional control and improved load capacity.
Pricing for a high frequency test socket with up to 200 leads and the new CAM lid starts at $3,700 per unit. Delivery is 6 weeks ARO.
For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown,
NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: info@arieselec.com;
Web: www.arieselec.com <http://www.arieselec.com>.
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READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825.
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