NanoVia Licenses Microvia Drilling Technology To Hitachi Via Mechanics, Japan

NanoVia, LP announces the licensing of its hybrid optical technology for laser microvia drilling to Hitachi Via Mechanics, Japan. This announcement marks the culmination of several program milestones for NanoVia, LP, which included a direct investment by Hitachi Via Mechanics, a four-year exclusive license and the delivery of several optical sub-systems for future Hitachi products. All of the technology being licensed is patented or patent pending.

Immediate Press Release
May 24, 2002
NanoVia Licenses Microvia Drilling Technology To Hitachi Via Mechanics, Japan

Londonderry, NH (May 14, 2002) -- NanoVia, LP announces the licensing of its hybrid optical technology for laser microvia drilling to Hitachi Via Mechanics, Japan. This announcement marks the culmination of several program milestones for NanoVia, LP, which included a direct investment by Hitachi Via Mechanics, a four-year exclusive license and the delivery of several optical sub-systems for future Hitachi products. All of the technology being licensed is patented or patent pending.
NanoVia began its relationship with Hitachi Via Mechanics in fiscal year 2000 after presenting its latest laser microvia grid array system at the 2000 IPC show. The natural synergy between the two organizations has allowed the two groups to develop next generation products for the high-density packaging market.
The microvia drilling technology can increase throughput of standard systems by a factor of 2X and current R&D optical designs, which show capabilities of greater than 4X. The technology is optimized for grid array style packaging for chip packaging applications.
The HDI marketplace needs long term strategies for developing process technology that ensures yields, increases throughput and provides a good return on investment", explains Todd Lizotte, VP of R&D at NanoVia, LP," Our partnership with Hitachi Via Mechanics is a testament to Hitachis dedication to that philosophy."
NanoVia, LP – General
NanoVia, LP develops, designs and builds automated manufacturing equipment, optical systems and assembly/fabrication processes for the microelectronics packaging, telecom and micro-systems market. NanoVias core objective is to create intellectual property for licensing and sale to these markets. NanoVia welcomes inquiries about its technologies and system solutions.

Information Contacts:

NanoVia, LP            
Mr. Todd Lizotte, Vice President of R&D         
Phone: 603-421-0713            
Fax:    603-421-0214                  
Email: telizotte@nanovia.com       

Hitachi Digital Graphics
Mr. Osamu Sekine, President
Phone: 408-392-9650
Fax:    408-392-9655
Email: Sam.Sekine@hitachidigital.com