New Hub Blade from Kulicke & Soffa Offers An Immediate Solution for Dicing Low k wafers

K&S Nova Hub Blade Reduces Chipping/Peeling Common in Low-k Wafer Dicing

Kulicke & Soffa Industries, Inc. (PRWEB) July 17, 2003 -k wafers with high yield and good productivity, using current dicing equipment and practices.

By incorporating specific formulations of diamond concentration and nickel bond, K&S Nova Hub Blades address the specific needs of various low-k wafers to minimize chipping and peeling during the dicing process. High yields are achieved even while advancing wafers through the process at standard production feed rates.

As product features shrink in size, IC manufacturers are transitioning to low dielectric constant materials in wafer fabrication for greater IC performance. While offering faster electrical signal speed and lower power consumption, these low-k dielectric materials impose new challenges in maintaining yield without compensating productivity.

By maintaining cut quality at standard feed rates, the Nova Hub Blades enable the dicing of various low-k type wafers with high yield and good productivity.

K&S Semitec brand of Nova Hub Blades offer an immediate solution to the challenges imposed by low-k wafer dicing, without the need for significant investments in new capital equipment or new processes. With the Nova Hub Blades, customers can use current dicing equipment and familiar dicing practices.