ARIES INTRODUCES NEW CSP/MICROBGA SOCKET FOR TEST AND BURN-IN OF 14 TO 27 mm2 DEVICES IN APPLICATIONS UNDER 1 GHz

ARIES INTRODUCES NEW CSP/MICROBGA SOCKET FOR TEST AND BURN-IN OF 14 TO 27 mm2 DEVICES IN APPLICATIONS UNDER 1 GHz

Frenchtown, NJ (PRWEB) September 27, 2003 -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has released a new CSP/MicroBGA test and burn-in socket for devices from 14 to 27 mm2, in applications under 1 GHz. The new pressure-mounted socket requires no soldering and is ideal for test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices with a pitch of 0.50 mm and larger.

Aries new test and burn-in socket incorporates spring probe contacts that offer maximum ease of use and flexibility. The spring probe contact Interposer set can be easily replaced on-site, and Interposer sets with different footprints for devices with the same overall package size can be used with the new socket. The socket also features integral plastic alignment posts that accurately line up the spring probe interposer set and socket to the PCB for secure mounting, and a 4-point crown to ensure scrub" on the solder oxides.

The small overall size of the socket allows for the maximum number of sockets per burn-in board (BIB), and BIBs per oven, while providing easy access for fast device insertion and removal.

The signal path during test is only 0.077" (1.92 mm) and operating temperature is -55°C to 150°C (-67°F to 302°F). Based on a device with a 0.50 mm pitch, pin inductance of the new socket is 0.75 nH Max.; mutual inductance is less than 0.15 nH; and mutual capacitance is 0.03 pF max.

Compression spring probes are heat treated beryllium copper alloy with 30µ" min (0.75µm) gold per Mil-G-45204, over 30µ" min. (0.75µm) nickel per QQ-N-290. Contact force is 9g to 12g per contact for devices with pitches from 0.50 mm to 0.75 mm, and 17g to 20 g per contact for devices with an 0.80 mm pitch or larger. Estimated contact life is 500,000 cycles. Molded socket components are UL94V-0 Carbon-filled PEEK or glass-filled Ultem, with a Teflon coated backing plate. All hardware is stainless steel.

As with all Aries sockets, the new CSP/MicroBGA socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.

Pricing starts at $130 each for a 100-ball package in burn-in quantities. Delivery is 2 weeks ARO.

For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown,
NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: info@arieselec.com;
Web: www.arieselec.com, Data sheet #23018-www.arieselec.com/products/23018.pdf.

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READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825.

EDITORS NOTE: Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.