NEW ARIES THERMOELECTRIC-COOLED RF TEST SOCKETS PROVIDE INCREASED THERMAL CONTROL AND COST SAVINGS

NEW ARIES THERMOELECTRIC-COOLED RF TEST SOCKETS PROVIDE INCREASED THERMAL CONTROL AND COST SAVINGS

Frenchtown, NJ, January 2003 – Aries Electronics, Inc., an international manufacturer of standard, programmed and custom interconnection products, now offers its lines of Interposer, Spring Probe, and Microstrip Contact RF test sockets with thermoelectric cooling. Test sockets with the new conduction-cooling system are suitable for BGA, LGA and CSP package designs and are typically used in high-powered devices that require exceptional thermal management, such as in military applications.

The use of thermoelectric cooling saves the user both time and money. The system eliminates the need for other costly methods of thermal control, such as a flow stream system, since the test socket is in direct contact with the cooling system. Additional thermal management properties that help reduce costs and testing time include a built-in thermistor to record temperatures and a copper heat sink with an integrated fan assembly.

Overall socket size is 63.5 mm x 63.5 mm x 88.9 mm and can be used in packages up to 27 mm x 27 mm. Temperature range of the test sockets with thermoelectric cooling is -15°C to 90°C (5°F to 194°F), with a maximum differential temperature of 70°C (158°F).

Pricing for a 484-lead BGA Spring Probe socket starts at $5,300 per unit, with quantity discounts available. Delivery is 6 weeks ARO.

For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown,
NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: info@arieselec.com;
Web: www.arieselec.com.

- 30 -

READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825.

EDITORS NOTE: Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.