Oxford Performance Materials and Hi-Tech Mold and Tool have Jointly Developed a Technology to Meet the Demands of World Leaders in Automated Semiconductor Handling Equipment

Oxford Performance Materials, Inc. (OPM) and Hi-Tech Mold and Tool have jointly developed coating technology that dramatically improves semiconductor wafer handling. The OXPEKK wafer edge grip process has doubled the lifespan of the wafer grippers

Oxford Performance Materials, Inc. (PRWEB) October 16, 2003 -Tech Mold and Tool have jointly developed coating technology that dramatically improves semiconductor wafer handling. The ultra pure high performance thermoplastic OXPEKK® polymer is being injection-molded around the tip of a stainless steel substrate (wafer edge grip), thus maintaining rigidity with minimum contamination and minimum wear over hundreds of thousands of gripping cycles. The process ensures that the OXPEKK material makes direct contact with the wafer where prevention of contamination is most critical.

The OXPEKK wafer edge grip process has doubled the lifespan of the wafer grippers," noted Lynne Thoma, Director of Research and Development for OPM. "This is critical in the semiconductor industry, when systems are running around the clock. In addition to decreased wear, distortion of the silicon wafer during gripping is noticeably decreased".

OPM has worked jointly with Hi-Tech Mold and Tool to develop the edge grip over-molding process. The process offers excellent repeatability and can accommodate both low and high volume applications. Hi-Tech Mold and Tool is a full service injection molder of engineering thermoplastics, supplying custom molded parts for the medical, aerospace, consumer, automotive and semiconductor markets. Hi-Tech Mold and Tool is located in Pittsfield, MA in their modern 55,000 sq. ft. facility, featuring a 5,000 sq. ft. class 100,000 clean room and 5,000 sq. ft. tool room.

Founded in 2000, OPM has rapidly become an industry leader in the high-performance thermoplastic materials market. OPM has a strong semiconductor application focus and actively develops advanced material solutions to improve yields and lower overall cost of ownership. The firm's versatile OXPEKK products are currently being used in aerospace, medical, semiconductor, and industrial markets worldwide. For additional information, contact OPM at info@oxfordpm.com or visit the OPM website at www.oxfordpm.com.