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All Press Releases for May 16, 2003 Subscribe to this News Feed      
 

AWR and OEA International Partner to Offer Gold Standard Extraction Technology

Deployment of Extraction Module in AWR Products Dramatically Improves Modeling Accuracy and Speeds Time to Market

EL SEGUNDO and MORGAN HILL, Calif. (PRWEB) May 16, 2003 -frequency electronic design automation (EDA) tools, and OEA International, Inc. (OEA), the industry leader in 3D interconnect extraction, today announced a technology licensing agreement that enables AWR to integrate into its high-frequency EDA design environment the core interconnect extraction technology, including the fast proprietary Cheetah" solver, from OEAs NET-AN 3D critical multi-net field extractor. The companies also announced a marketing agreement enabling AWR to market a number of OEA products through its worldwide distribution channels.

The integrated product provides analog and radio frequency integrated circuit (RFIC) designers with a new level of interactivity and ease-of-use through AWRs unified RF design environment, while enabling full access to all the features and capabilities of OEAs industry standard extraction technology. The combined solution will provide the highest level of accuracy and performance for large-scale RFICs, and thus maximizing designers productivity and speeding up the product development cycle time for wireless and wireline communications products.

As analog and RFIC designs move up the performance scale and use more advanced deep sub-micron technologies, the need for extremely accurate extraction increases," said Ersed Akcasu, president and CEO of OEA. The power behind this tool comes from OEAs proprietary Cheetah 3D field solver that is the EDA industrys only seamless full-field solver for full chip net applications. Integration with AWRs industry-leading RF design environment will give AWR customers designing wireless IC products access to the most accurate interconnect extraction technology available in the industry."

The integration of OEAs unique interconnect extraction technology into AWRs unified RF design flow enables analog and RFIC designers to accurately extract, simulate and analyze high-frequency effects on the interconnects while creating the physical layout. This will eliminate the time-consuming and error-prone sequential design steps and reworks that currently exist in todays RFIC design flows," said James Spoto, president and CEO of AWR. This tightly integrated solution delivers an unprecedented level of accuracy and performance in RFIC design that significantly increases designer productivity and speeds time to market."

About the AWR/OEA Technology Agreement
AWRs unified RF data model provides a comprehensive set of interconnect models spanning from ideal short circuit, to lumped element, to transmission line model, and to full 3D electromagnetic (EM) model. The incorporation of OEAs Cheetah 3D field solver extraction technology extends the range of interconnect modeling to include extraction of distributed resistance, capacitance, inductance and mutual inductance (RCLK) models directly from physical layout, enabling full flexibility in accuracy and performance trade-off in RF interconnect analysis. The Cheetah extraction program, the core technology in OEAs NET-AN product, is the only true seamless 3D critical multi-net field extractor that takes into account the full 3D nature of the problem, providing accurate simulation of even the largest and most complex nets. An embedded version of the OEA Cheetah solver technology will be integrated into AWRs design flow and will be available in the second half of 2003.

About the AWR/OEA Marketing Agreement
AWR and OEA also entered into a marketing and reselling agreement by which AWR will market a number of OEA products through its worldwide distribution channels. The list of products include:
•   NET-AN/Turbo – a multi-net 3D IC net extraction tool providing the capability to extract the same RCLK data for a larger scale and within a system of networked computers.
•   RF-PASS – a RF passive component synthesis tool enabling the simulation of RF passive components for frequency-dependent RCLK and producing an N-Port S-Parameter model.
•   SUB-AN - a substrate modeling tool for creating a simplified model of the substrate resistance network.
•   PKG-AN - a 2D/3D parasitic extraction package for general purpose package and printed circuit board (PCB) transmission-line model extraction to a SPICE or matrix format.
About OEA International, Inc
OEA International, Inc. designs and licenses state-of-the art parasitic extraction software for the electronic computer aided design (ECAD) industry. OEA software is designed to be extremely high performance and handle very complex models with a high degree of accuracy. OEA products are used to substantially increase engineering productivity and first time success in the design of interconnect and packaging technologies for sophisticated electronic systems and integrated circuits. The company has secured the extraction accuracy leadership role by working closely with major IC and system companies using the most modern process technologies available. Through these relationships, the company has applied it 3D extraction expertise to provide a family of critical net design tools, signal integrity analysis tools, and RF component design tools. For additional information call (408) 778-6747, or visit OEA online at www.oea.com

About Applied Wave Research, Inc.
Applied Wave Research was founded in 1994 and is a leading supplier of high-frequency electronic design automation (EDA) products for the design of wireless telecommunications equipment, semiconductors, high-speed computers, networking systems, and a variety of other electronics-based products. AWR is a privately held company and has development offices, sales offices, training centers, and global distribution. AWR has over 400 customer companies worldwide, including virtually every major high-frequency electronic component and system supplier. AWR partners with other leading EDA companies, such as Cadence Design Systems, Inc. (NYSE:CDN), and Synopsys, Inc. (Nasdaq:SNPS), to ensure interoperability in all existing design flows. The company is located at 1960 East Grand Avenue, Suite 430, El Segundo, California 90245. For more information about AWR and its products, please visit www.mwoffice.com or call 310-726-3000.

AWR, the AWR logo, Microwave Office, and EM Socket are trademarks of Applied Wave Research, Inc. OEA, the OEA logo, NET-AN, Cheetah are trademarks of OEA International, Inc. All other marks are the property of their respective holders.

--end--

For more information, please contact:

Ann Shubnell, Marketing Communications
Applied Wave Research, Inc.
1960 East Grand Avenue, Ste. 430, El Segundo, CA 90245
Tel 310-726-3000 – Fax 310-726-3005
info@mwoffice.com

Heidi Vantulden - For Applied Wave Research, Inc.
Bluestone PR, Inc.
Tel 503-524-9799
heidi@bluestonepr.com

Jerry Tallinger, VP of Marketing and Sales
OEA International, Inc.
155 East Main Avenue, Ste. 110, Morgan Hill, CA 95037
Tel 408-7786747 – Fax 408-7786748
jerry@oea.com

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