TTPCom Collaborates on New DigRF Interface Standard for EDGE

* Enables greater silicon choice for handset manufacturers * Defined by an alliance of leading cellular silicon companies

Cambridge, UK (PRWEB) March 30, 2004 --TTPCom Ltd, the worlds leading independent supplier of digital wireless technology, today announces its involvement in the creation and development of the DigRF interface standard for EDGE, Classes 1 to 12 (www.digrf.com). The DigRF standard defines a physical interface between the baseband and radio ICs (Integrated Circuits) within cellular terminals, enabling any combination of supporting chipsets. This new standard will increase competition in the market by enabling handset manufactures to select the most appropriate GSM, GPRS or EDGE baseband and radio combination, whether that is based on cost or advanced features, without undertaking significant integration risks.

Andrew Fogg, Senior Research and Development Engineer at TTPCom and Chairman of the Digital Interface Working Group comments, The DigRF standard gives terminal designers a wider choice of chipset combinations by ensuring compatibility between baseband and RF ICs. The standard intentionally confines itself to the interface between the chips and so places very few constraints on the internal design of the ICs, leaving manufacturers free to innovate and define efficient solutions."

TTPCom is heavily involved in the Digital Interface Working Group alongside other industry leaders including Agere Systems, Infineon Technologies, Motorola, Philips, Renesas, RF Micro-Devices, Silicon Laboratories, Sony Semiconductors and Devices Europe and Skyworks.

Version 1.12 of the DigRF standard covers GSM, GPRS and EDGE and is available for download from http://www.digrf.com. The Digital Interface Working Group has started work on the 3G version of the Interface Standard, which will be released in Spring 2005.

For more information on the DigRF Interface Standard and TTPComs cellular baseband and radio designs visit booth 532 in the South Hall at Electronica USA, San Francisco from 30 March -- 1 April 2004.

About DigRF
Formed in 2002, the Working Group is a collaboration between the member companies who recognised the benefit of creating an interface standard, as chipset designs move away from the analogue I/Q" interface, that had become the de facto standard, to an all-digital interface between baseband and RF. The DigRF standard has been made freely available for any IC designer to use, in the hope that it in turn will become the commonly accepted interface definition for next-generation chipsets. More information can be found on the DigRF website at http://www.digrf.com.

About TTPCom
Based in Cambridge, UK, TTPCom Ltd. is the principal operating subsidiary of TTP Communications plc (LSE: TTC). The company develops intellectual property used in the design and manufacture of wireless communication terminals. TTPCom licenses its technology to leading semiconductor and terminal manufacturers worldwide, including Analog Devices, Intel, LG, Renesas, Sharp, Siemens and Toshiba.

TTPCom has established an industry standard with its GPRS platform, offers EDGE, 3G, Wireless LAN and Wireless PAN solutions and, for those manufacturers for whom a fast time to market is critical, TTPCom also offers complete handset and module designs. Over 23 million devices using TTPCom technology were shipped during 2003. More information can be found on TTPComs website at: http://www.ttpcom.com.

Contacts:
Angela Manthorpe, TTPCom Limited, Melbourn Science Park, Cambridge Road, Melbourn, Royston, Herts, SG8 6HQ, United Kingdom. Tel: +44 (0) 1763 266266, Email: angela.manthorpe@ttpcom.com.

Allan Edwards, Neesham Public Relations, Tel: +44 (0) 1442 879222, Email: allane@neesham.co.uk