Speedline Technologies To Showcase New Product Features At SEMICON West 2004
Speedline Technologies, Inc. will showcase a host of new product features for its electronics manufacturing equipment during SEMICON West 2004, July 14-16, in the San Jose, Calif., Convention Center, at booth number 11520.
They will include the Accel® MicroCel Centrifugal Cleaning System, the Camalot® XyflexPro High Volume Batch Dispenser System, and the Camalot® XyflexPro Needle Cleaning Station,
FRANKLIN, MA (PRWEB) May 26, 2004 --- Speedline Technologies, Inc. will showcase a host of new product features for its electronics manufacturing equipment during SEMICON West 2004, July 14-16, in the San Jose, Calif., Convention Center, at booth number 11520.
They will include the Accel® MicroCel Centrifugal Cleaning System, the Camalot® XyflexPro High Volume Batch Dispenser System, and the Camalot® XyflexPro Needle Cleaning Station:
·The new MicroCel Centrifugal Cleaning System provides incomparable cleaning of electronic circuit assemblies, precision parts, medical devices, bumped wafers and advanced packages, such as flip chips, MCMs, BGAs, CSPs, and hybrid circuits. The MicroCel introduces an enhanced, easier-to-use operator interface with new productivity-enhancing features including: New PLC control, a new graphical user interface (GUI), the ability to store and retrieve up to 50 recipes, adjustable programming, configurable alarms, and the option to manage recipes remotely via an Ethernet link.
·The XyflexPro Needle Cleaning Station helps manage material build-up on the needle tip and prevents any possibility of material drip. When combined with the Bent Needle Detection Option, the system maintains process integrity by minimizing the potential for product damage or scrap by automatically verifying the straightness of the needle. The Needle Cleaning Station provides enhanced process control through improved dispensed weight repeatability, and it eliminates the potential for material to drip onto substrates or die.
·The Camalot XyflexPro HVB Dispenser System delivers truly dramatic process improvement and cost of ownership benefits with the highest throughput underfill solution on the market -- typical performance is three-to-five times faster than conventional single lane systems. The system uses a proprietary, patent-pending, conveyorless material handling system, and dual dispense heads. These innovations optimize the number of parts in process to fully absorb long capillary flow times, part transport times, and extended product heating times. The new system also features leading Camalot DU (Dispense Unit) pump technology, Multi-Piston Pump technology and the Benchmark software platform.
The three products will be among a host of systems to be showcased by Speedline Technologies during SEMICON West 2004, July 14-16, in the San Jose, Calif., Convention Center, at booth number 11520.
All are available immediately from Speedline distributors and representatives. For additional information, contact Speedline Technologies at 1-508-520-0083 or visit www.speedlinetech.com.
About Speedline Technologies
Speedline Technologies is the global leader for single-source process knowledge, solutions, and service to the PCB assembly and semiconductor packaging industries. Based in Franklin, Massachusetts, the company sells five, best-in-class brands -- ACCEL microelectronics cleaning, CAMALOT dispensing systems, ELECTROVERT wave soldering, reflow soldering, and cleaning equipment, MPM stencil and screen printing systems, and PROTECT global services, support, and training solutions. For more information, visit us at www.speedlinetech.com.
Note to Editors: High resolution photo images are available on request.
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