Speedline Technologies Schedules Free Monthly Technical Webcast Seminars

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Speedline Technologies, Inc. has scheduled a series of free monthly technical webcast seminars exploring the major challenges facing engineers in the semiconductor manufacturing process. Each of the seminars, to be hosted by industry experts, will include the sharing of Â?knowledge in processÂ? expertise, how-to insights and a Q & A session.

Speedline Technologies Inc. has scheduled a series of free monthly technical webcast seminars exploring the major challenges facing engineers in the semiconductor manufacturing process. Each of the seminars, to be hosted by industry experts, will include the sharing of “knowledge in process” expertise, how-to insights and a Q & A session. The schedule is:

“Lead-Free Wave Soldering”

  •      Thursday, September 23, 2004
  •      Live: 11 a.m. - Noon, ET and 2 p.m. – 3 p.m., ET
  •      Is your wave soldering process ready for the transition to lead-free materials? There are many misconceptions about equipment requirements for lead-free wave soldering. This seminar will explore what is really required for this transition. Topics will include:

         o Wave solder equipment configurations

         o Flux chemistries and solder alloys

         o Material/Equipment interaction

         o Defect reduction

“Improving Final Product Quality”

  •      Thursday, October 21, 2004
  •      Live: 11 a.m. - Noon, ET and 2 p.m. – 3 p.m., ET
  •      The cost of a defect increases exponentially as it moves through the production process. A defect that ships to a customer costs hundreds of times more than an error that is discovered immediately after the printing process. However, even in a well-controlled production environment, defects still occur. What can be done to limit the number of defects and their impact on your production capabilities? This seminar will cover the following topics:

         o Cost and types of a defect

         o Impact of printing defects on first pass yield

         o Preventing defects

         o Inspection and test process planning

         o 2D and 3D solder paste inspection

“Reliable Underfill Dispensing”

  •      Thursday, November 18, 2004
  •      Live: 11 a.m. - Noon, ET and 2 p.m. – 3 p.m., ET
  •      There are many applications for underfill dispensing and all require significant knowledge about the various materials and equipment used for the process. This chip connection process step is critical for flip chip manufacturing and can use many types of materials. This seminar will cover the following topics:

         o Why use underfill?

         o Underfill materials

         o Underfill process variables

         o Improving material flow

         o Equipment variables

         o Equipment optimization & dispensing patterns

“Fine Pitch Printing Process”

  •      Thursday, December 16, 2004
  •      Live: 11 a.m. - Noon, ET and 2 p.m. – 3 p.m., ET
  •      As technology continues to move towards smaller components, it becomes increasingly important to print to meet fine pitch requirements. With 0201 chips, chip scale packages and microBGAs becoming more prevalent, a process engineer must fully understand every aspect of the fine pitch printing process. Topics in this seminar will include:

         o Squeegee selection

         o Solder paste evaluation

         o Lead free solder paste printing

         o Stencil design, including pin-in-paste

         o Aperture design

         o 45 degree printing

         o Board support

         o Fast cycle time printing

         o Post-print inspection (2D and 3D)

All seminars are free. Participation is as easy as visiting a website and dialing into a toll-free telephone number.

To register, or for more information, visit http://www.speedlinetech.com/seminars on the Web or call 508-541-4749.

About Speedline Technologies

Speedline Technologies is the global leader for single-source process knowledge, solutions, and service to the PCB assembly and semiconductor packaging industries. Based in Franklin, Massachusetts, USA, the company sells five, best-in-class brands – Accel® microelectronics cleaning, Camalot® dispensing systems, Electrovert® wave soldering, reflow soldering, and cleaning equipment, MPM® stencil and screen printing systems and Protect® global services, support, and training solutions. For more information, visit us at http://www.speedlinetech.com

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Don Goncalves
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