Nitto Denko Announces Price Increase of Epoxy Molding Compound

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Molding compound is used in the assembly and protection of semiconductor manufacturing.

Nitto Denko has announced a price increase of approximately 100 yen per kg for its epoxy molding compound, a high-grade encapsulating resin used in the assembly of semiconductors. The across the board price increase is attributed to the recent cost increase of raw materials such as epoxy and filler, as well as to a tight supply of some of the ingredients required for manufacturing. The price increase will take effect in December 1st shipments.

Nitto Denko’s world class materials excel at protecting highly sensitive semiconductor devices from heat, shock, humidity, chemicals, and corrosion. Nitto Denko molding compounds have unique chemical and physical properties, finding use in various electronic applications including optical devices such as LEDs and optical sensors. All encapsulating materials are manufactured with thorough consideration for ease of handling, excellent mold-ability, efficient process-ability, and achieve remarkable levels of reliability.

About Nitto Denko

Nitto Denko Corporation, founded in 1918 and headquartered in Osaka, Japan is comprised of 103 companies in 23 countries. Nitto Denko is the world wide leader in manufacturing of polymer based products with 12 products commanding the top share of world markets. The company’s web site is located at http://www.nitto.com. Nitto Denko America, Inc. established in 1969 and located in Fremont, California is the sales and marketing office for Nitto Denko’s products in North America. The company’s web site is located at http://www.nittousa.com.

Editorial Contact(s):

Janet Collins                

Nitto Denko America, Inc.        

510-445-5466

[email protected]        

Keith Takahashi

Nitto Americas Inc.

510-445-5443

[email protected]

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Janet Collins
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