FRANKLIN, MA (PRWEB) May 23, 2005
Speedline Technologies, the global leader for single-source process knowledge, solutions, and service to the PCB assembly and semiconductor packaging industries, will showcase the industryÂs leading solutions and technologies at Nepcon Thailand 2005, Bangkok, 16-19 June 2005.
Speedline Technologies will host ongoing exhibits and demonstrations of the solutions in Booth No. 4D29 throughout the Exhibition, including:
Â· The MPM AccuFlex stencil printer, ideally suited for moderate volume high-mix printing at a cost-effective price, combines accuracy and unparalleled flexibility in a compact footprint. Providing only what is needed for efficient and precise printing, the AccuFlex offers electronics manufacturer a full range of options for future expansion. Designed for production of about 8,000 boards per week with two or more product changeovers per shift, the system easily handles boards from 3" x 2" to 23" x 20" and is capable of printing 12-mil pitch devices with consistent accuracy.
Â· The accurate, flexible, and configurable Camalot XyflexPro dispensing system features a calibration-free linear gantry drive system, small footprint, and ability to meet any application need through easy-to-add options. Whether dispensing micro dots of silver epoxy, solder paste for high-frequency devices and wafer-level packages, adhesive for 0201 components, or underfill for flip chip packages or flip chip on board, the XyflexPro system provides the required accuracy to maintain ultimate process control.
Â· The MPM Gel-FlexÂ Tooling System is an innovative and cost-effective answer to the challenge of supporting the circuit board during the stencil printing process. Consisting of non-conductive polyurethane elastomer gel enclosed within a durable membrane shell and mounted to a magnetic base, Gel-Flex tooling is a true conformal board-support system. The compressible gel material provides gentle compliance to delicate bottom-side components and leads while providing firm support for the entire board surface. This tooling system is available for AccuFlex, AP Excel, Ultraprint 2000, and UltraFlex BBP printers. It is also available as an upgrade for those printers as well as the AP Series, Ultraprint 400 and Ultraprint 500 platforms.
For more information, contact Mr. Kwa Siong Soon, SpeedlineÂs Business Manager, or Mr. Phermphoon Ekpho, Niche Tech (2004)Âs MD.
Speedline Technologies: The Process Knowledge Leaders
Speedline Technologies is the global leader for single-source process knowledge, solutions, and service to the PCB assembly and semiconductor packaging industries. Based in Franklin, Massachusetts, USA, the company sells five, best-in-class brands Â AccelÂ® microelectronics cleaning, CamalotÂ® dispensing systems, ElectrovertÂ® wave soldering, reflow soldering, and cleaning equipment, MPMÂ® stencil and screen printing systems, and ProtectÂ® global services, support, and training solutions. For more information, visit Speedline Technologies at http://www.speedlinetech.com or contact:
Â· In Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411, E-mail: firstname.lastname@example.org;
Â· In the USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288, E-mail: email@example.com;
Â· In Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299, E-mail: firstname.lastname@example.org.
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