Franklin, MA (PRWEB) September 9, 2005
Speedline Technologies, Inc., will showcase industry leading MPM printers, an Electrovert reflow oven and wave soldering equipment at ATExpo 2005, 27-29 September, in Rosemont, IL, booth number 5710.
SpeedlineÂs exhibit at the show will spotlight the following systems from the comprehensive line of assembly equipment solution the company delivers to the electronics assembly and semiconductor packaging industries:
SpeedlineÂs MPM AccuFlex printing system will be part of the live, working electronics assembly line at the center of this yearÂs show. The printer is ideally suited for moderate volume, high-mix printing at a cost-effective price. Combining accuracy and unparalleled flexibility in a compact footprint, the printer provides only what is needed for efficient and precise printing, while offering a comprehensive range of options for future expansion or demanding advanced processes. The system is designed for production of about 8,000 boards per week, with two or more product changeovers per shift.
In its booth, Speedline will spotlight its newest stencil printer, the MPM Accela printing system. The revolutionary new design and theory of operation in this printer have created a paradigm shift in the way electronics manufacturers view and measure printer performance. With the AccelaÂs innovative parallel processing technology the focus of measuring printer performance has shifted from base cycle time to total throughput, the more important criteria for manufacturers requiring high volume throughput with high yield performance. The new system produces the most boards per hour of any industry printer Â delivering raw throughput gains of 20% to 80% over the closest competitor and generating more quality boards per hour; therefore increasing the return on capital investment.
The printer is also designed for ease of use, and features a completely new, robust design and easy-to-use operator interface. Offering superior accuracy and repeatability, this printer is well positioned for the challenge of lead-free assembly and the increasingly complex boards used throughout the industry.
Also on display will be SpeedlineÂs Electrovert OmniExcel 7, a lead-free capable, 7-zone, forced convection reflow oven specifically designed to optimize operating efficiencies, reduce maintenance intervals, and lower life-cycle costs.
The system features an advanced chamber design for more balanced airflow with minimal turbulence, which improves heat transfer and substantially reduces power and N2 consumption. Compared to other platforms, the OmniExcel consumes up to 50% less power and up to 35% less nitrogen. Besides multiple other options the system can be equipped with SpeedlineÂs proprietary self-cleaning Flux Extraction Systems (FES), delivering a dramatic drop in maintenance intervals from a typical weekly schedule to once per month, which translates into more uptime for our customers. SpeedlineÂs newest enhancement, the OmniCheck monitoring system, delivers a cost-effective, redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters.
In addition Speedline will exhibit two systems that simplify the process and enhance the quality of the lead-free manufacturing, its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.
The Quick-Change Solder ModuleÂs design allows for easy changeover between tin/lead and lead-free alloys and its cast iron solder pot and other components are resistant to the corrosive nature of lead-free solders and capable of withstanding temperatures of 315ÂºC (600ÂºF).
SpeedlineÂs new UltraFill Lead-Free Nozzles feature an innovative technology and design to overcome a variety of process challenges inherent in lead-free wave soldering.
The nozzles are 40% wider than traditional tin/lead nozzles to increase contact length and dwell time. The nozzles are also placed closer together to reduce the temperature drop between the nozzles Â so that less heat is needed to reflow solder joints in the second wave. As a result, UltraFill nozzles deliver better hole fill without requiring a slowing of the conveyor, while reducing bridge defects and dross production.
With the optional nitrogen shroud either air or nitrogen operation can be chosen; without the need to change nozzles. Recent applications have shown UltraFill nozzles enhance both product quality and process.
All of the featured solutions are immediately available from Speedline distributors and representatives. For more information, visit Speedline Technologies during ATExpo 2005 in booth number 5710, contact your Speedline distributor or representative, or reach Speedline Technologies at 1-508-520-0083 or http://www.speedlinetech.com.
ATExpo 2005 will be held September 27-29, 2005, at the Donald E. Stephens Convention Center, Rosemont, IL, USA.
About Speedline Technologies
Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands Â Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. Speedline Technologies is Frost & SullivanÂs Â2005 Surface Mount Technology Company of the Year.Â For more information, visit: http://www.speedlinetech.com or contact Speedline at:
Â USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288, E-mail: email@example.com;
Â Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299, E-mail: firstname.lastname@example.org;
Â Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411, E-mail: email@example.com.
Note to Editors:
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