Challenges of 0201 and 01005 Component Assembly Are Focus of Free Webcast Seminars on February 16th
Speedline Technologies experts will tackle issues involved the 0201 and 01005 component assembly process in free, live webinars on Thursday, February 16, 2006 designed for OEM and CEM process engineers. Visit http://www.speedlinetech.com/seminars.
Franklin, Mass. (PRWEB) January 23, 2006 -- Speedline Technologies experts will tackle issues involved the 0201 and 01005 component assembly process in free, live webinars on Thursday, February 16, 2006 designed for OEM and CEM process engineers.
The continuing demand for smaller, lighter portable products has escalated the use of miniature components throughout the electronics industry. Two packages, currently being used for resistors and capacitors, are the 0201 and 01005 chip component packages. Assembling these components present a number of challenges for an electronic manufacturing operation.
Speedline Technologies will host the free one-hour Internet seminars to explore these challenges on Feb. 16th. Two live sessions are available: the first at 2 a.m. to 3 a.m. U.S. EST (2 p.m. to 3 p.m. Singapore Time), and the second at 11 a.m. to 12 p.m. U.S. EST.
The webinars will consist of an educational presentation, discussion of new technologies and techniques, practical how-to advice, and a Q&A opportunity. Specific areas of discussion will include:
- Printed Circuit Board Pad Design
- Solder Paste Printing
- Solder Paste Selection
- Component Placement
- Reflow Soldering
- Inspection
- Questions and answers
To register, go to http://www.speedlinetech.com/seminars or call 1-508-541-4749.
Each month, Speedline Technologies hosts a free one-hour Webcast tackling the SMT industry’s most pressing manufacturing challenges. The schedule throughout 2006 as follows:
- Thursday, March 16: Lead Free Reflow Soldering
- Thursday, April 13: Adhesive Printing
- Thursday, May 18: Pin in Paste (Intrusive Reflow)
- Thursday, June 15: Lead Free Wave Soldering
- Thursday, July 13: Challenges of High Speed Underfill
- Thursday, August 17: Lead Free Printing Process
- Thursday, September 14, 11:00 a.m. ET: Practical DOE and SPC for Electronics Assembly
- Thursday, October 19: Cleaning Lead Free Residues
- Thursday, November 16: MicroDot Dispensing
- Thursday, December 14: 0201 and 01005 Component Assembly Process
For times and to register, visit http://www.speedlinetech.com/seminars, or call 1-508-541-4749.
About Speedline Technologies
Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands — Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. Speedline Technologies is Frost & Sullivan’s “2005 Surface Mount Technology Company of the Year.” For more information, visit: http://www.speedlinetech.com or contact Speedline at:
- USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288;
- Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299;
- Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411.
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