Shanghai, China (PRWEB) April 10, 2006
Comlent Technology Inc., China’s leading fabless radio-frequency integrated circuit (RFIC) design house, announced today that its transceiver for third generation (3G) mobile terminals (TD-SCDMA standard) successfully completed a phone call on a TD-SCDMA network. Comlent is the first Chinese RFIC chip company to achieve this milestone. Strong local transceiver and baseband IC (BBIC) chipset support could further accelerate the technology readiness for China’s upcoming 3G deployment. Previously, only two U.S. companies were providing TD-SCDMA transceiver samples to five BBIC chip companies and over twenty mobile terminal design houses in China.
As the world’s largest mobile handset market, China’s total number of mobile subscribers is projected to reach 441 million by the end of this year, with annual growth of approximately 50 million, according to the China Ministry of Information Industry (MII). China also manufactures most of the world’s mobile handsets for both domestic and overseas markets. According to MII, in 2005, China manufactured approximately 290 million mobile handsets, or over 40% of the world’s projected total handset output in the year.
TD-SCDMA, initiated and developed by China, is one of the three approved global 3G standards expected to be deployed once 3G is launched in China. In addition to TD-SCDMA, two other 3G international standards, CDMA2000 and WCDMA, have been proposed and deployed by Europe and the U.S., respectively. Some weaknesses of TD-SCDMA are its short history in comparison to the other three 3G standards and the scarcity of local communication chip infrastructure in China, resulting in few IC companies that are able to design the ICs, specifically the transceivers that can support it.
“As China’s first mass production proven RFIC design house, Comlent’s mission is to provide local mobile and portable consumer markets with world-class RF and mixed signal chip solutions that have been missing in China,” stated Dr. Kai Chen, President and CEO of Comlent. “Comlent will continue to closely work with our strategic partners such as Commit, a leading TD-SCDMA baseband IC company and Jazz Semiconductor, a leading U.S. semiconductor foundry specializing in RF, high voltage, and analog processes, to provide the most competitive product, best service and strongest local support to China’s 3G market.”
“As a BBIC company for the TD-SCDMA market in China, Commit gladly congratulates Comlent on becoming the first Chinese RFIC company that has accomplished this important milestone in 3G transceiver development. More remarkably, Comlent’s TD-SCDMA transceiver employs leading-edge zero intermediate frequency (zero-IF) architecture and has achieved the world’s first TD-SCDMA transceiver that integrates both the transmitter and receiver on a single chip,” commented Mr. Evan Yu, CEO of Commit Incorporated. “The close cooperation between local baseband and RF chip companies will empower local mobile handset designers and producers to support successful deployment. Therefore, these joint efforts will play a key role in the healthy growth of China’s TD-SCDMA in the 3G arena.”
“Jazz Semiconductor is pleased to support Comlent as its foundry partner. RFIC transceivers are complex chips to design. The achievement of mass production of their earlier transceiver chips for PHS mobile handsets and the recent success of the 3G transceiver design, are commendable milestones to achieve,” stated Marco Racanelli, vice president of technology and engineering at Jazz Semiconductor.“ Jazz will continue to support Comlent as they pursue their strategic commitment to the emerging Chinese market.”
Established in 2002, Comlent is China’s first established and first mass production proven radio frequency integrated circuit (RFIC) design house. Its current major product line focuses on RF and mixed signal chips enabling wireless communication and key features for both mobile terminals and portable multi-media player (PMP) devices. For more information, please visit http://www.comlent.com.
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