Full ASIC Design & Manufacturing Services with 90nm Fujitsu Wafer Foundry
IComm Technologies Inc. today announced the joint partnership with ICNexus in Taiwan to provide full cycle ASIC Design and ASIC Manufactur¬ing services with 90nm Fujitsu Wafer foundry.
King of Prussia, PA (PRWEB) July 23, 2006 -- IComm Technologies Inc. today announced the joint partnership with ICNexus in Taiwan to provide full cycle ASIC Design and ASIC Manufactur¬ing services with 90nm Fujitsu Wafer foundry. Our Fujitsu 90nm advanced technology highlights include Advanced Lithography and Etch Technology to achieve 40nm Gate Length; Low Temp Process for Shallow Junction; Process Optimization for High Carrier Mobility; Low-k (~2.9); Dual Damascene Cu; High Density 6T SRAM with sub-1um2 cell. The Fujitsu 90nm advanced technology with low-power is a perfect solution for 3G wireless baseband ASIC chip set for PDA and Cell phones applications.
Our ASIC design services support a wide range of design from Wireless Communication Base¬band processors to Computer Network processors, DSP, to digital Video Audio chip set. Our ASIC manufacturing services support a wide range of services from Wafer Production to Wafer Testing to Packing and Final production.
Our front-end ASIC design services support all level of design start from specifications to sys¬tem level design to RTL design, Simulations, Synthesis, ATPG scan insertion, P&R layout, to final GDSII netlist hand-off.
A summary of our ASIC Design & Manufacturing Services can be found thru this weblink http://www.icommtech.com/ASIC_90nm_IComm_ICnexus.pdf. For your immediate require¬ments, please visit our website http://www.icommtech.com, fill out the RFQ form and email.
About IComm Technologies, Inc.
IComm Technologies is a fabless semiconductor company that designs, develops and markets high performance Wireless Baseband Processor for the new 3G W-CDMA, 3G CDMA2000 Wireless Communication Systems.
For more information, please visit website http://www.icommtech.com. Or, send email to info@icommtech.com.
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