IMAPS Project Bridges ITRS and iNEMI Roadmaps

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The IMAPS Global Business Council announced a new effort to bridge the leading industry roadmaps to ensure detailed coverage of challenges in semiconductor packaging and related areas.

IMAPS, the International Microelectronics and Packaging Society, has begun a study of two of the most widely used industry roadmaps, the International Technology Roadmap for Semiconductors (ITRS) and the roadmap of the International Electronics Manufacturing Initiative (iNEMI). The ITRS is centered on technical chip-level challenges, while the iNEMI roadmap addresses primarily the upcoming requirements at higher levels of integration. The Global Business Council (GBC), the IMAPS initiative that addresses business and market issues for its members, has taken on the job of distilling the key packaging challenges in the roadmaps and ensuring that IMAPS sponsors forums that contribute to finding specific solutions. The GBC is collaborating with key members of the IMAPS National Technical Committee, who plan the technical programs, in order to make sure the roadmaps challenges receive focused attention.

“Both the ITRS and iNEMI roadmaps cover packaging, which is where they intersect, but packaging is just a small portion of each,” said Laurie Roth, Co-Chair of the IMAPS GBC. “This is where the leadership of IMAPS thought that we could contribute by focusing exclusively on the packaging section of the roadmaps. By thoroughly evaluating the packaging content of each, we will be able to address the critical needs facing us through our advanced technology workshops, publications, and other IMAPS activities.”

“IMAPS members look to the organization for guidance as they steer their businesses and make career decisions,” stated Mike O’Neill, Vice President of Membership for IMAPS. O’Neill added, “A key goal of this IMAPS roadmap initiative is to clarify and focus the future of the industry for our members. We identify the gaps, so that our corporate members can focus on the solutions and grow their businesses by satisfying the acknowledged needs of the industry.”

The IMAPS roadmap effort grew out of the presentations at IMAPS GBC workshops, where future trends are discussed by industry experts. The IMAPS National Technical Committee also helped to formulate the approach for the IMAPS roadmap initiative.

A full update on the activities and findings of the IMAPS roadmap effort will be given at the IMAPS International Microelectronics Symposium to be held October 8 – 12, 2006 at the San Diego Convention Center.


IMAPS, the International Microelectronics and Packaging Society, is a non-profit organization dedicated to the education and interaction of its members in the semiconductor packaging, assembly, and test industry. The mission of IMAPS also includes promoting the capabilities and achievements of its members and the microelectronics industry as a whole. IMAPS organizes about a dozen advanced technology workshops every year, covering such topics as flip-chip technology, LED packaging, MEMS, automotive electronics, and high-reliability applications. The IMAPS flagship event is the annual International Symposium on Microelectronics, which is one of the premier technical conferences in the industry and is now in its 39th year. IMAPS has 43 local chapters worldwide. The Society’s services include the bi-monthly Advancing Microelectronics magazine, a weekly e-mail news bulletin, the bi-weekly Corporate Bulletin, the academic quarterly Journal of Microelectronic Packaging, and numerous resources on its website. IMAPS is headquartered in Washington, DC.


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