PTI Will Exhibit Non-Destructive Blister Package Inspection System at Pack Expo in Chicago, IL

Packaging Technologies & Inspection (PTI) will exhibit the VeriPac 225/BLV inspection system at the Pack Expo Show running October 29 – November 2, McCormick Place in Chicago IL, PTI Booth S-1878.

Tuckahoe, NY (PRWEB) September 10, 2006 -- Packaging Technologies & Inspection (PTI) will exhibit the VeriPac 225/BLV inspection system at the Pack Expo Show running October 29 – November 2, McCormick Place in Chicago IL, PTI Booth S-1878.

The VeriPac 225/BLV is a non-destructive inspection system for blister packaging. The core technology is based on the ASTM approved vacuum decay leak test method F2338-05 that was developed using PTI’s VeriPac instruments. Special vision technology is combined with this vacuum decay test method to easily identify the location of defective blister cavities.

This is the first inspection method for blisters that is able to test the integrity of the entire package and identify leaks within the individual cavities, without destroying the product or package. This system is an excellent process control tool for both the pharmaceutical industry and the rapidly growing nutriceutical market.

This is a robust system, specially esigned to overcome many of the challenges involved with testing blister packaging that haven’t been solved with many inspection methods.

Tony Stauffer, president of PTI, states “This is the first inspection method for blisters that is able to test the integrity of the entire package and identify leaks within the individual cavities, without destroying the product or package. This system is an excellent process control tool for both the pharmaceutical industry and the rapidly growing nutriceutical market.”

Unlike most current test methods for blister packages, the VeriPac 225/BLV can be used on all types of multi-cavity blister packaging materials, paper, foil, plastic, laminates and all surfaces whether lat, glossy, printed or non-printed. Another advantage of the VeriPac 225/BLV is how fast and easy it is to test different types of blister packaging.

The unique design of this system enables fast changeover from one blister format to another. Automatic recognition software identifies the blister format immediately. This saves considerable time and decision making for operators.

Stauffer adds, “This is a robust system, specially esigned to overcome many of the challenges involved with testing blister packaging that haven’t been solved with many inspection methods."

Packaging Technologies & Inspection (PTI) is a leading manufacturer of non-destructive inspection technologies for the pharmaceutical, medical device, food and container industries. Recognized as a thought leader in new delivery systems for seal, package and container integrity testing, PTI has set the standard for inspection systems that provide repeatable, reliable results. Having a PTI inspection solution in place for QA/QC process control guarantees that your package is “fit for purpose” from manufacturing through distribution.

Please contact Sanjeet Saxena for further information.
Tel: 914-337-2005

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