IMAPS Presents the Third Annual International Conference and Exhibition on Device Packaging

The Third Annual International Conference and Exhibition on Device Packaging (DPC) is being held in Scottsdale, AZ, March 19-22, 2007. The Conference is being produced and sponsored by IMAPS, the International Microelectronics And Packaging Society.

Washington, DC (PRWEB) February 1, 2007 -- The Device Packaging Conference will feature keynote speakers, technical sessions, professional development courses, and a vendor exhibition and technology showcase. The conference aims to provide a focused forum to hear and discuss the latest technological developments in 5 topic areas related to microelectronics packaging: FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical. Technical presentations in these 5 topical areas will range from early stage design work and R&D, to systems manufacturing and production operations. The professional development courses which are offered, as well as the vendor exhibition and technology showcase, are also focused on the microelectronics and packaging aspects of these 5 topical areas and should provide a very valuable added resource to people attending the conference. The Global Business Council (GBC) will be offering a stellar Spring Conference, March 18th & 19th which will focus on the business side of these technologies. There will also be several networking receptions and gatherings throughout the week, including the opening reception, meals and other social events.

"This conference is a major forum for the exchange of knowledge and provides numerous opportunities to network and meet leading experts in these 5 fields. The conference was organized to attract a fairly diverse group of people, across many different functional groups and experience levels within both industry and academics," stated Dr. Andrew Strandjord, General Chair of the 2007 Conference and Exhibition.

Attendees and Exhibitors nearly doubled the previous year's numbers at the 2006 Device Packaging Conference and we are looking to do that again in 2007.

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