GDSI's service model is centered on quick-turn delivery. In keeping with this value proposition, we have drastically streamlined our website so that our viewers can retrieve relevant information quickly
(PRWEB) April 4, 2007
Grinding & Dicing Services, Inc. GDSI, the industry choice for critical backend wafer servicing, has announced the launch of its newly redesigned web site http://www.wafergrind.com.
The site was developed and designed by GNA Marketing Group http://www.gnamg.com, a renowned brand identity and target marketing firm supporting the semiconductor industry. This new website features more intuitive navigation to highly specific service capabilities aimed at simplifying the viewing experience for current and prospective GDSI clients. In addition to its fresh look and design, the redesigned site offers GDSI customers a number of added resources including:
-Dynamic content updated regularly
-Detailed service capabilities call-outs
-Map Importation for Automated Inspection requirements
-Media Center with RSS Feeds
"GDSI's service model is centered on quick-turn delivery. In keeping with this value proposition, we have drastically streamlined our website so that our viewers can retrieve relevant information quickly", said Don Bolton, Sales Director for GDSI. "This new web site will help engineers zero in on their immediate needs and quickly determine whether GDSI can fill them."
About Grinding & Dicing Services, Inc.
Grinding & Dicing Services, Inc. is a leading backend service provider that has long been recognized as a pioneer in grinding, polishing and dicing. GDSI has processed a variety of materials coming in various shapes and sizes. Consequently, valuable process knowledge has been documented which can be readily applied to nearly any custom requirement. For more information about Grinding & Dicing Services, Inc. please visit http://www.wafergrind.com.