Interlink Electronics Invited to Participate on eSignature Panel at ACORD User Group Meeting (AUGIE)

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Interlink Electronics, Inc is proud to take part in the ACORD User Group (AUGIE) eSignature panel being held during the Independent Insurance Agents & Brokers of America's "BIG I Leadership Conference" in San Diego, CA from September 28-30, 2007. The goal of the panel discussion is to educate attendees on how to effectively deploy electronic signature technology.

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Interlink Electronics, Inc is proud to take part in the ACORD User Group (AUGIE) eSignature panel being held during the Independent Insurance Agents & Brokers of America's "BIG I Leadership Conference" in San Diego, CA from September 28-30, 2007. The goal of the panel discussion is to educate attendees on how to effectively deploy electronic signature technology.

Interlink has experienced first-hand the growth and acceptance of esignatures within the insurance industry over the last decade. Mike Ambrose, Senior VP of Technology and Product Development will share his technology and market expertise with the audience to help them better understand the requirements and benefits of implementing electronic signatures.

"With over 75,000 in-the-field insurance agents currently using Interlink's ePad and IntegriSign Signature software to capture their customers' signature, I am confident that the panel attendees will gain valuable 'how to' information from Interlink," explains Rod Vesling, VP of Sales and Marketing for Interlink Electronics.

About Interlink Electronics Inc.:
Interlink Electronics, Inc. (LINK.PK) provides the financial services industry as well as the healthcare and government sectors with the electronic signature platform needed to eliminate paper from critical business processes. Interlink's complete solution including e-signature software, hardware, and services allows organization to implement end-to-end electronic processes no matter where the signing takes place: in-branch, in-the-field or online. Interlink Electronics is also known for its family of MicroNav products, powered by the company's patented Force Sensing Resistor (FSR) technology and integrated in handheld consumer electronics devices. Headquartered in Camarillo, California, Interlink Electronics, Inc. also has offices in Japan, Hong Kong, and China. http://www.interlinkelectronics.com/esign

For additional information, please contact:
Nathalie Benoit
Interlink Electronics, Inc.
Cell: 805-279-2750

For Investor Relations information, please contact:
Michelle Lockard
Interlink Electronics, Inc.
805-484-8855 ext. 114

All registrations and trademarks are properties of their respective owners. IntegriSign is a registered trademark of Interlink Electronics, Inc. This release contains forward-looking statements that involve a number of risks and uncertainties. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: business conditions and growth in the electronics industry and general economies, both domestic and international; lower than expected customer orders; delays in receipt of orders or cancellation of orders; competitive factors, including increased competition, new product offerings by competitors and price pressures; the availability of third party parts and supplies at reasonable prices; changes in product mix; significant quarterly performance fluctuations due to the receipt of a significant portion of customer orders and product shipments in the last month of each quarter; problems or delays in reporting our results of operations to the public; and product shipment interruptions due to manufacturing problems. The forward-looking statements contained in this document regarding industry and review trends, industry product and technology acceptance, product mix and future business activities should be considered in light of these factors.

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Nathalie Benoit

Michelle Lockard
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