Packaging World Announces 2008 Workshop Series Covering Packaging Line Performance

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A new course, Packaging Line Performance Workshop, will give professionals the skills, tools and knowledge they require to measure and improve the efficiency of their packaging lines.

Summit Publishing Company's Packaging World will produce a series of Packaging Line Performance Workshops in 2008. The two-day intensive Workshops will teach the fundamentals of packaging line performance and strategies for improvement. Attendees will learn how to measure OEE (Overall Equipment Effectiveness) on their lines, and will take away practical experience to put to immediate use. The Workshops will be offered in six cities throughout the U.S. and Canada in 2008.

Workshop creator, Summit Publishing Company's Vice President, E-media, David Newcorn comments: "Our goal is for Workshop attendees to learn how to implement actionable strategies to boost line efficiency, without getting bogged down in math. We've designed the program for production managers, plant managers, project engineers, continuous improvement specialists, maintenance professionals and plant technicians. Paul Zepf, our Workshop instructor, literally 'wrote the book' on packaging line efficiency; attendees will receive excellent value for their investment."

The Packaging Line Performance Workshop is co-produced by Zarpac, Inc., a packaging technology company supplying engineering services, system integration, data acquisition software and custom design build solutions. Zarpac's Paul J. Zepf, M. Eng. P. Eng., CPP, is the Workshop instructor; Zepf is the author of ten books on packaging production systems, and has researched and developed new concepts for calculating and designing packaging processes, machinery and effective operations.

Packaging Line Performance Workshop registration is now open at http://www.PackagingPerformance.com , or by calling Liz Tierney, Customer Support Manager, at Summit Publishing Company at 312-222-1010, ext. 130.

About Packaging World
Packaging World is the flagship publication of Chicago-based Summit Publishing Company. This privately held company is an integrated media publisher offering business information for packaging professionals including print magazines PACK EXPO Showcase; Healthcare Packaging and Contract Packaging. In addition to packaging e-newsletters, Summit Publishing Company also produces Webcasts and a variety of conferences for packaging professionals.

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