Washington, D.C. (PRWEB) January 22, 2008
The Global Business Council of the International Microelectronics And Packaging Society (IMAPS) is targeting important questions with its Spring 2008 Meeting theme, "Addressing Cost and Performance-Driven Semiconductor Packaging through the Supply Chain."
The program will kick-off with a Keynote Address by Bill Bottoms, CEO, NanoNexus, the title of which is "The 10th Anniversary Edition of the International Technology Roadmap for Semiconductors."
Session Chairs of the Meeting are Gary Nicholls, OEM Marketing Manager, Cookson Electronics and Lee Smith, Senior Director of Business Development, Amkor Technology, Inc.
Sessions will include a Microelectronics Industry Overview, a session on Cost Driven Challenges and one on Performance Driven Challenges. In a joint statement, Howard Imhof, GBC Co-Chair, Director of Sales and Marketing, Metalor USA, and Greg Caswell, GBC Co-Chair, Vice President of Sales and Marketing, D2M Technologies, said, "Nicholls and Smith have succeeded in bringing together the industry experts who will be addressing the cost needs in specific areas of assembly and packaging that will enable the growth of the industry, the applications where performance is the absolute driver and the opportunities in the supply chain that can meet these challenges."
The Global Business Council's Spring 2008 Meeting will be held March 17, 2008, at the Fort McDowell Resort, Scottsdale, AZ.
Founded in 1967, IMAPS is the leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 21 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS hosts a variety of technical workshops and conferences and professional development courses that enable these professionals to enhance their careers. In addition, The Microelectronics Foundation provides annual grants to students involved in electronic packaging disciplines.