Professor Bi Keyun, President of China Electronics Packaging Society, will be a Featured Speaker at Global Business Council's Spring 2008 Meeting

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Prof. Bi Keyun to head a delegation from China at the IMAPS Global Business Spring Meeting

The Global Business Council (GBC) of the International Microelectronics and Packaging Society (IMAPS) announces that Prof. Bi Keyun, president of the China Electronic Packaging Society (CEPS), will head a delegation from China and speak at our meeting in Scottsdale, AZ, March 16 and 17, 2008.

Prof. Keyun will speak on "The Development of the Semiconductor Packaging and Testing Industry in China." He will cover the rapid development of the Chinese semiconductor industry that has, between 2001 - 2007, experienced an average increase of 33.6 percent.
Prof. Keyun is also president of the Packaging Branch of the China Semiconductor Industrial Association which has 250 members and presents an annual International Conference on Electronic Packaging Technology (ICEPT).

"We are extremely pleased that Prof. Keyun has agreed to speak at our meeting. We know that the information he will impart will be of vital importance to our attendees," stated GBC Chair, Howard Imhof, Metalor Industries. "We look forward to welcoming the delegation from China," he added.

For more information and program details, please visit

About the Global Business Council
The IMAPS Global Business Council (GBC) is an initiative within IMAPS which leads the development and communication of the business view of and for IMAPS' corporate membership.

The mission of the GBC is to provide value to IMAPS corporate membership by focusing on the business side of technology for microelectronics and packaging. This will be accomplished by development and presentation of events highlighting relevant business topics of interest to corporate membership.


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