Oxford, UK (PRWEB) March 10, 2008
Oxford Solders, part of the BizEsp group, announced the launch of new lead free solder paste and flux products under the label OXQ (short for Oxford Quality). Developed at the Company's engineering centre in Oxford, UK, the OXQ series of products offer advanced technology performance at highly competitive pricing and are to be unveiled at the Nepcon show in Shanghai, China (April 8 - 11, 2008).
Announcing the Nepcon launch of the OXQ series of lead free products, CEO Dr Dosten Baluch said, "This shows our commitment to and special focus on the China market and our total dedication to addressing challenges experienced by Chinese PCB assembly companies. We will not only supply quality products at very competitive prices but also make it our mission to help Chinese clients with local support such as training, applications engineering and trouble shooting. We are in China with a long term strategy, we will continue our investment in China and we fully intend to establish Oxford Solders as a major brand in China."
Dr Charles King, BizEsp CTO, said, "A solder paste is a complex product, requiring great skill and experience to deliver a product to the market that fulfils multiple sets of performance characteristics for example, robust reflow with resistance to humidity, solder ball splattering and excellent reliability or robust print performance with excellent resistance to hot slump. Achieving these characteristics consistently from lot to lot requires immense expertise that can only come from decades of practice in manufacturing solder pastes and servicing the PCB assembly industry."
King continued, "All of BizEsp's experience in lead free soldering stretching back to the late 1980s is encapsulated in our OXQ series of products. Additionally, we will provide our customers with hands on field support ranging from trouble shooting to applications engineering from our highly experienced American and European engineers. This type of support is enormously valuable and often not provided routinely in China by our competitors, even major brand names."
Oxford Solders pastes are designed and manufactured with advanced understanding of paste technologies and the underpinning sciences of chemistry, physics and metallurgy. The team has over 150 years combined experience of paste technology ranging from base solder alloys to powder manufacture to flux and paste manufacture to SMT applications engineering to reliability issues. Oxford Solders OXQ series is designed to deliver ultimate performance to SMT factories for lead free processing whilst the OXPro series offers continuing excellence in tin/lead soldering. They take pride not only in the quality of their products but also in the excellence of their technical service. They are focused on the Asia market and give direct technical support and training in all aspects of SMT applications engineering, trouble shooting and use of their products - including on-site support where necessary.
The OXQ series solder pastes are available in a range of SAC alloys in Type 3 to Type 5 powder sizes whilst OXPro series pastes are available in standard tin-lead alloys also in Type 3 to Type 5 powder sizes. Both OXQ and OXPro series pastes are available both in printing and dispensing formulations in jars and syringes. Low alpha wafer bumping pastes are also available from Oxford Solders. Requests for special alloy pastes can be made directly to BizEsp, UK. Additionally, Oxford Solders is offering a range of solder powders, fluxes and BGA spheres.
Further details and product data sheets can be downloaded from the Company's Web site at http://www.bizesp.com.