International Test Solutions Names Jerry Broz as Vice President of Applications

Share Article

Reno, Nevada based, semiconductor test company, International Test Solutions (ITS) names Jerry Broz, Ph.D. as Vice President of Applications.

Jerry is an outstanding technologist whose technical contributions and leadership are tremendous assets to International Test Solutions. He will now be responsible for driving the achievement of strategic technological goals that will enhance our long-term global growth.

International Test Solutions, Inc. ("ITS") recently announced the appointment of Jerry Broz, Ph.D. to the position of Vice President of Applications. He will have responsibilities for directing applications development, product support, and customer service of ITS products and services worldwide. Dr. Broz has served at the Sr. Applications Engineer for worldwide product and application support at ITS since 2003.

"Jerry is an outstanding technologist whose technical contributions and leadership are tremendous assets to International Test Solutions. He will now be responsible for driving the achievement of strategic technological goals that will enhance our long-term global growth." said Gene Humphrey, President of International Test Solutions.

Before joining International Test Solutions, Dr. Broz was a Member of Technical Staff with the Worldwide Probe Development Team at Texas Instruments, Inc. Dr. Broz has been worked in the field of wafer level test at various levels since 1994. He holds several patents and has numerous key publications in the areas of wafer level test and IC packaging.

Dr. Broz earned his Ph.D. in Mechanical Engineering from the University of Colorado at Boulder and has over 20 years of experience in various high volume manufacturing and applied research environments. He is also currently the IEEE Semiconductor Wafer Test (SW Test) General Chair after serving for over seven years as the Technical Program Chair.

About International Test Solutions, Inc. (ITS)
International Test Solutions provides non-destructive probe card cleaning products used by semiconductor manufacturers to remove debris and contaminants generated during wafer level and burn-in/test socket testing. By removing loose debris and adherent contaminants in-line, the quality of the testing data is improved, the test equipment downtime is reduced, throughput is increased and manufacturing yields are improved.

For more information about International Test Solutions, or this particular news article, please contact Tina Romero at (1) 775.284.9220.

###

Share article on social media or email:

View article via:

Pdf Print

Contact Author

Visit website