Oberg Industries Introduces Proprietary Grinding Technology

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Heat-free Molecular Decomposition Process™ achieves sub-micron tolerances and surface finishes or less than 1 RA, produces burr-free products

Molecular Decomposition Process (MDP) grinding technology provides burr-free, heat-free grinding eliminating secondary operations and achieving a surface finish of less than 1RA on very hard materials.

MDP can eliminate secondary operations such as electro polishing, micro blasting, and deburring without generating thermals or causing internal stress and distortion in the material. Its applications are endless

Oberg Industries introduces Molecular Decomposition Process™ (MDP™), an advanced grinding technology developed for removal or cutting of any conductive material. MDP uses an electrochemical action and an abrasive wheel to achieve surface finish of less than 1 RA and precision tolerances held to ± 0.0002" - all without generating heat. The process is used for consumer or industrial products where surface finish and dimensional stability are imperative such as grinding surgical needles, sharps and razor blades. Molecular Decomposition Process is also suitable for applications requiring a surface free of micro cracks and fissures or other highly polished weight bearing and articulating surfaces. Gentle enough to grind thin-walled components without damage or distortion, MDP works well with tubing, rapid cut-off needs and grinding of complex features in exotic metals including nitinol.

"MDP can eliminate secondary operations such as electro polishing, micro blasting, and deburring without generating thermals or causing internal stress and distortion in the material. Its applications are endless," said Joe DeAngelo, Director of Technical Development, Oberg Industries.

During Molecular Decomposition Process, an electric current flows between the negatively charged abrasive wheel and the positively charged work piece through an environmentally friendly electrolyte (saline) solution. A decomposing action occurs causing the material surface to oxidize. This oxidized surface is then removed by the specially formulated abrasives in the wheel exposing more material and repeating the cycle.

MDP cuts conductive materials 80 percent faster than conventional methods and is especially effective on super-alloys and exotic metals. It can be used with aluminum, beryllium, cobalt chrome, copper, Inconel, Iridium, Molybdenum, nickel, Nitinol, platinum, Rhenium , single crystal alloys, stainless steel, titanium, titanium carbide, tungsten carbide, zirconium and other conductive ceramics and plastics.

After working closely with Compositron Corporation, based in Brooklyn, NY, for over five years to further develop and refine the Molecular Decomposition Process, Oberg acquired the MDP technology and the full consumable products line of Voltron™ grinding wheels and electrolyte. Voltron grinding wheels and electrolytic solution continue to be manufactured and developed at Oberg's Sarver, PA, campus to fit a variety of cutting and grinding applications.

Oberg Industries, founded in 1948, specializes in providing precision technology and manufacturing solutions for Fortune 100 companies around the globe. Oberg is an integrated supplier of precision grinding, turning, multi-axis milling, high tolerance finishing, metal stamping, plating, tooling, automation and product assembly services. The company uses their ISO 9001and ISO/TS 16949 manufacturing facilities in Pennsylvania, Mexico and Costa Rica to support customers around the world focused in medical, automotive, metals packaging, aerospace/defense, housing and construction, consumer products, oil and gas exploration and interconnect markets. For more information visit http://www.oberg.com.

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Cheryl Boncek
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