IMAPS Announces Second Distinguished Keynote Speaker at IMAPS 2009

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The International Microelectronics And Packaging Society (IMAPS) is pleased to announce that Dr. Paul Franzon has agreed to be a Keynote Speaker at IMAPS 2009, the 42nd International Symposium on Microelectronics. The Symposium will be held November 1 - 5, 2009 at the McEnry Convention Center, San Jose, CA.

The International Microelectronics And Packaging Society (IMAPS) is pleased to announce that Dr. Paul Franzon has agreed to be a Keynote Speaker at IMAPS 2009, the 42nd International Symposium on Microelectronics. The Symposium will be held November 1 - 5, 2009 at the McEnry, Convention Center, San Jose, CA.

Dr.Franzon is currently a Professor of Electrical and Computer Engineering at North Carolina State University. He earned his Ph.D. from the University of Adelaide, Adelaide, Australia in 1988. He has also worked at AT&T Bell Laboratories, DSTO Australia, Australia Telecom and two companies he co-founded, Communica and LightSpin Technologies. His current interests center on the technology and design of complex systems incorporating VLSI, MEMS, advanced packaging and nano-electronics. He has lead several major efforts and published over 180 papers in these areas. In 1993 he received an NSF Young Investigators Award, in 2001 was selected to join the NCSU Academy of Outstanding Teachers, in 2003, and selected as a Distinguished Alumni Professor and in 2005 won the Alcoa award. He is a Fellow of the IEEE.

"With the addition of Dr. Franzon, IMAPS 2009 is offering the best possible keynote speakers who are experts in our technologies. Dr. Franzon's background and current field of endeavor gives him the ideal experience that IMAPS 2009 attendees are interested in hearing about," stated Jeff Demmin of Tessera, IMAPS 2009 General Chair.

For more details, please visit http://www.imaps2009.org

About IMAPS
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Our Society offers 69 chapters around the globe, creating global networks of more than 4,000 members in the United States and an additional 4,000 members throughout Europe and Asia. Under its 4-tier technical model, IMAPS produces numerous publications, workshops, and international conferences and exhibitions that address everything in electronics between the chip and the system.

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ANN BELL
IMAPS
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