Washington, DC (PRWEB) February 2, 2010
The International Microelectronics and Packaging Society (IMAPS) has announced four keynote speakers for their 2010 Device Packaging Conference and Exhibition. The Conference will be held March 9 – 11, 2010, in Scottsdale/Fountain Hills, AZ.
The Conference Keynote Speakers are: Brandon Prior, Senior Consultant, Prismark Partners, “3D Interconnect: The Challenges Ahead”; Steve Bezuk, Director of Package Development at Qualcomm CDMA Technologies, “ Migration to Flip Chip in the Wireless Application Space and Associated Challenges”; Jeff Perkins, General Manager - Business Development , Yole Developpment, “High Brightness LED Packaging: A Review of Technology and Trends” and Andrei Shkel, Program Manager, Micro Technology Office (MTO), Defense Advanced Research Program Agency (DARPA), “ A New Wave of Innovation in Micro-Technology for Positioning, Navigation, and Timing (muPNT)”.
“We are honored to have such a knowledgeable and distinguished group of industry experts introduce our technical tracks at the 2010 Device Packaging Conference and Exhibition. We know their remarks will enhance the substance of the excellent technical program we have planned,” said Dr. Phil Garrou, Microelectronic Consultants of NC, who serves as Conference General Chair.
About IMAPS - The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.