Carsem Receives Microsemi Corporation’s Best Supplier of the Year Award for 2009

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Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received Microsemi Corporation's Best Supplier of The Year Award for 2009 for assembly and test services that were provided by the Carsem factory located in Suzhou, China.

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received Microsemi Corporation's Best Supplier of The Year Award for 2009 for assembly and test services that were provided by the Carsem factory located in Suzhou, China. The award is based on Microsemi’s supplier program that measures key metrics such as, on-time delivery, yield, customer service, quality, competitiveness, responsiveness and technology.

Mr. Asaf Silberstein, Microsemi’s Vice President of Operations stated, “Carsem is one of Microsemi’s strategic vendors performing mainly integrated circuit assembly and test services. Carsem had demonstrated great service and support, enhanced the technology offering to Microsemi and were part of our unique high end solutions development for some of Microsemi’s new products. Carsem’s outstanding on-time delivery performance, high quality of services, flexibility, and dedication has led Carsem to win Microsemi’s the Best Supplier award for 2009.”

Mr. Peter Yates, Carsem’s Group Managing Director added, “We are truly honored to receive this prestigious award from Microsemi and are very proud of our Suzhou factory team’s performance. We look forward to further strengthening our partnering relationship with Microsemi well into the future.”

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com.

About Microsemi
Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals. Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com.

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Rick Flowers
Carsem
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