Ipoh, Malaysia (PRWEB) February 19, 2010
Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that the International Trade Commission (ITC) has issued a Notice of reversal and remand in Carsem's on-going patent litigation with Amkor Technology, ITC case number 337-TA-501.
The ITC has reversed the finding of the Administrative Law Judge (ALJ) that a third-party invention was not prior art to Amkor's patents, and has remanded the
Investigation to the ALJ to determine whether the patents are invalid. A final determination is now scheduled for July 20, 2010.
Mr. Peter Yates, Carsem's Group Managing Director said, "We are pleased with the Commission's decision and look forward to a successful conclusion to this long-running litigation."
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com.