Reconfigurable Chipsets Will Drive Proliferation of 4G Smartphones for WiMAX and LTE Networks

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A new DIGDIA report analyzes innovative designs emerging from leading semiconductor companies, predicting the next-generation of smartphones with configurable multi-band processors, software-defined radios, HD video, 3D graphics and 3G/4G wireless connectivity.

DIGDIA has analyzed the leading-edge integrated circuit designs under development at wireless semiconductor companies worldwide, finding that advances being made in higher performance, re-configurable architectures will lead to a new generation of smartphones that will drive more rapid adoption of 3G and 4G mobile broadband services.

Activities at recent wireless industry events such as the Mobile World Congress in Barcelona, and CTIA Wireless in Las Vegas, make it clear that operators are accelerating deployment of 4G WiMAX and LTE networks to meet the growing demand for higher-performance mobile broadband services. Smartphones that can access these new 4G networks are the key to subscriber adoption, driving the need for a new generation of mobile phone chip sets. New designs must be adaptable to the plethora of existing 3G standards while simultaneously supporting the progressive evolution to various implementations of 4G.

Designers at the 2010 International Solid States Circuits Conference, where the most significant advances in chip design are presented, showed that they are indeed meeting the challenges of next-generation smartphone requirements. In this report, the most significant of these innovations in wireless chip design are reviewed and analyzed for the impact they will have on the key building blocks in future handsets.

  • Programmable RF/Analog Front-End (RF/AFE) circuits that will enable 3G/4G global roaming.
  • Low-cost 4G baseband processors to accelerate implementation of LTE smartphones.
  • Software-Defined Radios that are configurable for LTE, WiMAX, WiFi and mobile TV.
  • Powerful application processors that will lower power consumption, increase performance and integrate heterogeneous processor cores, including H.264 codecs and 3D/2D graphics engines.
  • Multi-band mobile-TV SoCs combining support for ISDB, T-DMB, and DVB standards.
  • Audio output circuits to deliver lower-noise, with higher fidelity to drive headphones.

Companies covered in this report:

  • Advanced Circuit Pursuit
  • Analog Devices
  • ARM
  • Broadcom
  • Intel
  • Marvell
  • Nokia
  • NXP Semiconductors
  • Qualcomm
  • Renesas
  • Samsung
  • ST-Ericsson
  • Texas Instruments
  • Toshiba

The report is titled Next-Generation ICs for Mobile Devices - Innovations in Wireless Design. A free excerpt can be downloaded at http://www.digdia.com. For more information contact Michael Demler, Senior Strategic Analyst.

About DIGDIA - digdia helps companies find growth opportunities, create winning strategies & business plans in the digital entertainment value chain. Services include strategic consulting and market analysis with a balanced business & technical perspective.

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Michael Demler
DIGDIA
831-818-0993
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