Washington, DC (PRWEB) May 7, 2010
This year’s SEMICON West 2010 wil again have IMAPS as a contributing participant producing workshops and presentations..Of particular concentration this year for both SEMICON West and IMAPS is 3D IC, today’s leading edge packaging technology. SEMICON West 2010 will feature a pavilion especially devoted to these technologies.
IMAPS participation in SEMCON West is an integral part of the Society’s program of top notch technical sessions and state-of-the-art exhibitions.
IMAPS just featured a 3D track and 3D panel at the Annual Device Packaging Conference. The Conference was held in March 2010 in the Phoenix, AZ, area.
Following on the 6th International Device Packaging Conference, the 43rd Annual International Symposium on Microelectronics, IMAPS 2010, November 2-4, 2010 Raleigh Convention Center will feature a 3D track and 3D panel along with six other technical tracks, numerous Professional Development courses, world-renown Keynote Speaker and an exhibition hall of products and services in our industries.
About IMAPS - The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.