RC Connect-R is a response to the demand for simplicity, cost reduction and performance in compliant interconnect.
San Francisco, CA (PRWEB) July 13, 2010
Ardent Concepts, the Innovator in High Performance Compression Mount Connector and Socket Technology, presented data and mechanical samples of the latest in a string of advanced connector IP designs at Semicon West in San Francisco from July 13-15th.
"The release of RC Connect-R culminates several years of R&D and the integral support of our Customers," says Steve Cleveland, Vice President of Business Development. "We are extremely excited to begin shipping RC Connect-R designs for Semiconductor, Military and Medical applications where pitch, density, and performance are mission critical."
RC Connect-R, a stamped and formed compression mount contact, utilizes a unique geometry and standard industry materials to provide an exceptionally robust solution for large area array applications down to .6mm pitch. With Electrical performance to 25 GHz @ < -1dB, RC Connect-R allows engineers to design and build high speed custom solderless connectors as short as 2.2mm. This revolutionary system uses patented technology and is designed for automated assembly and high volume applications.
Gordon Vinther, Founder & President of Ardent Concepts is named as the Patent Holder for the new product. "We have been working with metal shapes and wire forms for over 7 years here at Ardent. RC Connect-R is a response to the marketplace demand for simplicity, cost reduction and performance in compliant interconnect.
Ardent Concepts is a New Hampshire based corporation with customers worldwide. For more information, email info(at)ardentconcepts(dot)com or call 603-926-2517.
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