Washington, DC (PRWEB) September 15, 2010
Washington, D.C. – September 7, 2010 – The International Microelectronics And Packaging Society (IMAPS) is pleased to announce that IBM will be exhibiting at the 43rd Annual Symposium on Microelectronics (IMAPS 2010). The Symposium exhibition will be held at the Raleigh Convention Center, Raleigh, North Carolina, November 2 – 4, 2010.
The IBM Systems and Technology Group will be represented by the System x Server Power, Packaging, and Cooling team. The IBM Data Center Services team will showcase technologies used to develop servers and optimize data center system utilization and energy efficiency.
The System x Server Power, Packaging and Cooling team is responsible for product development of IBM System x,® IBM BladeCenter® servers, and IBM System x iDataPlex solutions. The team integrates the latest chip and subsystem technologies into a high performance x86 based computer system that is user friendly, energy efficient and cost effective.
The IBM / IMAPS booth will provide an overview of power, mechanical packaging, and thermal computer system design and development, as well as technologies used to optimize the management and energy utilization within the data center.
“IMAPS is excited that IBM has chosen to showcase some of its research and applications at IMAPS 2010. The exhibition of this research and development will garner an enormous amount of interest in our Symposium,” stated Howard Imhof, Metalor Technologies and IMAPS President.
For more information, please visit http://www.imaps2010.org.
IMAPS leads the Microelectronics Packaging, Interconnect and Assembly Community, providing a means of communicating, educating and interacting at all levels.
The International Microelectronics And Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions bringing together the entire microelectronics supply chain. Our events and products focus on those technologies critical to the present and future of microelectronics: 3D Integration, MEMS, Flip Chip, Wafer Level Packaging, Thermal Management, Printed Electronics, Advanced Materials, Photonics, Modeling/Design and many others. (Read more about IMAPS.)