form factor with a minimal module thickness of 0.140
Rancho Santa Margarita, CA (Vocus) July 28, 2010
Virtium Technology Inc., a leading designer and manufacturer of memory modules for specialized computers in demanding environments, has announced the release of a new design for the 4GB DDR3 ECC Unbuffered Mini-DIMM in the Ultra Low Profile (ULP) 0.700” form factor with a minimal module thickness of 0.140” or 3.56mm.
Virtium is the first to release the enhanced DDR3 4GB VLP Mini-DIMM (MiniDIMM) model design using mainstream 2Gbit DDR3 DRAM monolithic package components. The new advanced 4GB Mini-DIMM layout technique is applied to reduce the module’s overall thickness, allowing more airflow through the components and throughout the system to improve system reliability and MTBF, mean time between failures.
Other alternatives to this 4GB ECC Mini-DIMM design include 2Gbit BGA stacking, dual die packaging (DDP), or a non-VLP module design. 2Gbit BGA stacking is a commonly used method to create high density single socket modules without space restrictions. This design creates a much thicker module of 0.260” or 6.6 mm, 50% thicker than the Very Low Profile (VLP) Mini-DIMM design. The dual die package method is a high-priced alternative that generates a higher volume of heat than a single die component of a monolithic package design. The non-VLP design forms a taller module with a height of 0.787” or 20mm, more suitable for applications without space constrained requirements.
Virtium’s 4GB DDR3 4GB Mini-DIMM’s non-stacking feature produces a module with a thickness of 0.140” or 3.56mm to meet dual socket system layout requirements, while keeping cost low. “With the improved module design, we’ve been able to provide a module that solves the industry’s system thermal concerns while offering an alternative low cost solution,” said Phan Hoang, Vice President of Research and Development for Virtium Technology. “The new 4GB Mini-DIMM design provides a 40% cost reduction compared to the use of a DDP DRAM component and is projected to decrease in price by 14% by end of this Q4.”
Other Product Enhancements for DDR3 VLP Mini-DIMM
- Additional Thermal Heat-Spreader
- Extended Temperature Screening of -40C to +85C
- Conformal Coating
- Under-Fill Protection
- Thermal Sensor
The enhanced module is well suited for router applications used in embedded computing, networking, and telecom.
For a product more information, contact Virtium at sales(at)virtium(dot)com or visit http://www.virtium.com.
Since 1997, Virtium memory solutions have been integrated by leading computer manufacturers around the globe, in a wide variety of challenging industries where performance and reliability are paramount, including embedded systems, networking/telecom, storage servers, military/aerospace, medical, and infotainment markets. Virtium combines first to market memory solutions with continuity of support for legacy memory products in mature systems. Virtium provides extra-mile service to save design engineers and procurement professionals’ time and money. Virtium delivers a worry-free experience.
Its memory module product line encompasses a wide range of densities and data transfer rates in all major memory product categories including DDR3 and DDR2 MiniDIMM, VLP MiniDIMM, VLP Unbuffered Mini-DIMM, VLP Registered Mini-DIMM, SO-UDIMM, SO-RDIMM, ECC SODIMM, Mini-UDIMM and Mini-RDIMM, together with enhancements needed in challenging environments.
Headquartered in Southern California, Virtium is a privately held, financially-sound technology company with U.S. based design and manufacturing facilities certified to IS0 9001:2000 and AS9100 Rev. B. Virtium maintains representative offices throughout the U.S., Europe and Asia. For more information, call toll-free at 1-888-VIRTIUM (1-888-847-8486) or visit Virtium Technology online at http://www.virtium.com.