"RSP Technology can reduce front side metallization costs up to 50% while also improving cell efficiency."
Cranston, RI, USA (PRWEB) February 12, 2011
Technic is pleased to announce the release of TechniSol® Ag 2460, a cyanide free silver plating solution formulated specifically for use with RSP (Reduced Silver Paste) Technology on silicon solar cells. RSP Technology applies a fine line screen printed seed layer that is then electroplated with a smooth silver layer, resulting in increased efficiencies at a significantly reduced cost. The bath operates at 20 g/l silver, a concentration similar to most other baths in the industry, but because of key advances in its formulation TechniSol® Ag 2460 produces very fine grain deposits with no lateral growth. This improved electrolyte formulation also allows manufacturers to plate up to 30% faster and still maintain optimum deposit integrity. In addition to the advantages in RSP Technology, TechniSol® Ag 2460 may be used to plate on nickel or copper grid lines, creating a superior solderable layer. TechniSol® Ag 2460 is also formulated for compatibility with LIP (Light Induced Plating) as well as standard electroplating applications.
“RSP Technology can reduce front side metallization costs up to 50% while also improving cell efficiency. TechniSol® Ag 2460 maximizes these efficiency gains and improves cell through-put, which establishes it as a leading silver plating solution in the solar industry.”
- Anthony Gallegos, Technic Global Product Manager for Solar Technology