ESI Hires New VP of Business Development

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Industry Veteran Stefano Concina to play key role in ESI’s strategic growth initiatives

Electro Scientific Industries, Inc. (NASDAQ: ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that Stefano Concina has joined the company as vice president of business development. Concina brings to ESI more than 27 years in business development, investment and operations management experience in the semiconductor and microelectronics industries.

"ESI has a strong history of delivering innovative, laser-based microengineering solutions in the semiconductor, LED and consumer electronics markets," said Nick Konidaris, president and CEO of ESI. "Stefano’s proven track record building collaborative relationships with key manufacturers and partners in the U.S., Japan and Europe will play a key role as ESI continues executing our growth strategy of investing and diversifying into high-growth markets and applications."

Concina joins ESI after spending more than 15 years in senior management positions at KLA-Tencor, most recently as the managing director of the KT Venture Group. He holds a degree of Ingénieur from ESIEE (France) and an MSEE from Caltech. In his new role, Concina is responsible for assisting in the management and development of ESI’s corporate growth strategy, building strategic partner relationships, and facilitating merger and acquisition activity.

About ESI, Inc.
ESI is a leading supplier of innovative, laser-based manufacturing solutions for the microtechnology industry. Our systems enable precise structuring and testing of micron to submicron features in semiconductors, electronic devices, LEDs and other high-value components. We partner with our customers to make breakthrough technologies possible in the semiconductor, microelectronics and other emerging industries. Founded in 1944, ESI is headquartered in Portland, Ore, with global operations from the Pacific Northwest to the Pacific Rim. More information is available at


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